Used OXFORD Plasmalab 100 #293798318 for sale

OXFORD Plasmalab 100 is an etcher/asher designed for irreversible precision etching and microscopic surface structuring of any rigid material. The machine is capable of etching and ashing both organic and inorganic materials including metals, alloys, dielectrics, glass, and ceramic materials. Plasmalab 100 has a small footprint, yet can accommodate large wafers and substrates up to 10.25 inches in diameter. Its flexible design allows for a wide range of process parameters, meaning precision microstructuring can be performed at extremely low, medium, and high temperatures with a controlled atmosphere. OXFORD Plasmalab 100 is equipped with a precision mass flow controller (MFC), providing accurate and repeatable gas flows, along with a turbomolecular pumping system to accurately control the pressure in the system. A loadlock chamber is integrated with the machine, allowing for quick and easy substrate loading and unloading. The integrated plasma source of Plasmalab 100 is capable of producing RF and DC plasma utilizing a "floating electrode" technique. This technique allows OXFORD Plasmalab 100 to produce extremely low, controlled densities of plasma to provide a high level of accuracy and precision nec-essary for microstructuring processes. Plasmalab 100 can also provide deep-etching capabilities, allowing for features and structures of various depths and shapes to be produced reliably and with repeatable results. The machine can also be used for surface modifications through doping or deposition in order to further increase the material's desired properties. In order to ensure that best results can be achieved with each run, OXFORD Plasmalab 100 features onboard process monitoring and control. By using advanced process control systems, the machine's operations can be closely monitored and adjusted in real-time. This helps to guarantee high quality, repeatable processes and reliable results. To round out the capabilities of Plasmalab 100, the machine is fully compatible with a wide range of both upfront and post-processing hardware. Techniques such as photolithography, X-ray diffraction (XRD), secondary ion mass spectrometry (SIMS), surface force microscopy (SFM), and optical imaging can be used to both monitor and analyze the resultant patterns. In conclusion, OXFORD Plasmalab 100 is a high precision etcher/asher with a flexible design and a wide range of capabilities. Its integrated plasma source and monitoring system enable it to produce the highest quality results at low temperature with repeatability. In addition, due to its compatibility with various outside hardware, it is possible to both monitor and analyze the patterns produced.