Used OXFORD Plasmalab 100 #293830473 for sale
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OXFORD Plasmalab 100 is an etcher/asher equipment designed for advanced sample preparation and deposition applications. It is a multi-cathode etcher and asher combination, equipped with low-electron voltage. It offers full flexibility in pattern design and process parameter selection, as well as being able to operate with standard substrates. Plasmalab 100 features three independent 20 cm diameter etch chambers, each configured with two moving magnetron cathodes, allowing for dual and triple processes in each chamber. High-speed scanning of the magnetrons, together with the option of static operation, yields good etch uniformity and control. The process gas is introduced at different rates, so that it is always at the optimal concentration for etch/ash processes. The system includes a number of configurable process parameters and features. The cathode power can be set between 0 and 350 W and the energy can be changed in 1 W increments. There is a safety-interlock and control unit that ensures the integrity of the process. The sample holder has a universal support for all types of substrates. OXFORD Plasmalab 100 also offers a wide range of ashing techniques, including low-temperature ashing, dielectric etch-back, and traditional oxygen or oxidant based aggressive ashing. In addition, the machine can also perform side-wall passivation and nitridation. A low-energy ion bombardment (LEIB) tool is also included in the tool's toolchain to remove any particles and debris that may form during the process. The ETCH/ASH process can be monitored in-situ with either a mass spectrometer or an optical interferometer. The asset also has an integrated remote diagnosis tool that can be used to adjust the model parameters quickly. Plasmalab 100 is an incredibly powerful equipment suitable for a wide range of applications, from sample preparation and etching to deposition and processing. Its flexibility and advanced features make it an ideal solution for the most demanding applications.
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