Used OXFORD Plasmalab 100 #9188881 for sale

OXFORD Plasmalab 100 is a powerful etcher/asher. It is a chamber-based equipment, used for nanofabrication in combination with high-performance plasma processes. The system features a large quartz chamber with a low-vacuum environment and controlled gas flows, allowing for accurate etching or ash work. The chamber is also equipped with a large substrates support as well as dedicated in-situ optical modules, a 2D mapping software, and a segmented chamber with different pressure regimes. Plasmalab 100 unit has a magnetic ‐ gas supply and it uses RF‐driven discharges, allowing the user to control the active species inside the chamber and deposit layers on the substrate. The machine is ideal for etching and ash processing of different materials, including complex structures. It allows for an accurate control and repeatability of the developed process since the individual plasma species densities, temperature and pressures can be precisely adjusted and stabilized. OXFORD Plasmalab 100 tool is also capable of working with a variety of substrates, such as stainless steel, silicon, glass and polymer substrates, allowing users to develop etching and ash applications for the development of nanoscale structures. Plasmalab 100 asset features an advanced computer-controlled gas handling model, allowing for the use of different gases, enabling optimal etching and ash properties. The equipment is also equipped with advanced diagnostic tools, such as mass spectrometers, Langmuir probes and toroidal electrode arrays, which enable the user to control the dynamics of the plasma processes. OXFORD Plasmalab 100 can also be used for nitriding processes, anodizing and surface modifications. Additionally, the system is compatible with a wide range of accessory components, such as masks, electrostatic chuck, shadow masks and microscopes. Plasmalab 100 has been designed to provide high-performance etching and ash processes in a low-pressure, safe and repeatable environment, allowing the user to safely develop complex nanostructures. Its advanced features enable quick and precise plasma process optimization and reproducibility. The unit is suitable for research and production applications and it is often used in semiconductor processing and MEMS applications.