Used OXFORD Plasmalab 100 #9220686 for sale

OXFORD Plasmalab 100 is an advanced etching and ashing equipment designed for precision plasma etching and ashing applications. This system uses a combination of high-power radio frequency (RF) power delivery and precise process control to deliver precise etching and ashing results. The unit is equipped with a 12-inch assignable mass-focused 24-GHz magnetron source that provides up to 2 kW of RF power. This machine is capable of depositing multiple layers of material without over-etching and without adding significant particle contamination levels. Plasmalab 100 features a wide selection of post-process ashing options allowing for a range of uses including material preparation, photolithography, and contamination removal. The tool's based power delivery and process control provide a wide range of etching and ashing options like aluminum etching and ashing, silicon etching and ashing, glass etching and ashing, and other types of etching and ashing. The asset is well suited for applications such as the preparation of samples for wafer testing, lithography and the preparation of new wafers. The model is able to etch and as both isotropically and anisotropically without significant particle penetration. It is also equipped with a highly configurable batch processing equipment that includes a variety of user-defined programmable parameters. OXFORD Plasmalab 100 is easy to use and maintain, offering users a comprehensive range of tools for developing complex etching and ashing processes. The system offers a low-frequency ECR source, an automatic flow-feed sub-unit, and single-coil and double-coil heating options. The machine also features a large, 6" x 12" working area, allowing for a variety of sample sizes. Overall, Plasmalab 100 is a powerful and reliable etching/ashing tool. It is designed for precision etching and ashing results and is well suited for a wide range of applications, from material preparation and contamination removal to wafer testing and lithography.