Used OXFORD Plasmalab 80 Plus #293698011 for sale

ID: 293698011
Wafer Size: 4"-6"
Vintage: 1998
PECVD System, 4"-6" Deposition: SiNx, SiO2, SiH4 and Si at 300°C EDWARDS E2M80 Vacuum pump Mass Flow Controller (MFC) RF Generator Burner gas abatement PC Controller 1998 vintage.
OXFORD Plasmalab 80 Plus is a highly advanced etcher/asher equipment designed for precise and efficient plasma processing in semiconductor device fabrication and research applications. This system is known for its versatility, flexibility, and reliability in producing high-quality results in plasma etching, ashing, and surface modification processes. Plasmalab 80 Plus is equipped with a wide range of features and capabilities that make it suitable for a variety of materials and applications. It is capable of handling substrates of various sizes and materials, including silicon, gallium arsenide, glass, and ceramics. The unit offers both reactive ion etching (RIE) and inductively coupled plasma (ICP) etching modes, allowing users to choose the most suitable process for their specific needs. One of the key features of OXFORD Plasmalab 80 Plus is its advanced process control capabilities. The machine is equipped with a powerful RF generator that enables precise control of plasma parameters such as power, pressure, and gas flow rates. This allows users to optimize process conditions for maximum etching or ashing efficiency while ensuring uniformity and repeatability across batches. Plasmalab 80 Plus also features a versatile gas handling tool that enables the use of a wide range of process gases, including oxygen, fluorine, chlorine, and argon, among others. This allows users to customize the chemistry of the plasma to achieve specific etching or ashing results, such as high selectivity, anisotropic etching, or isotropic plasma cleaning. In addition to its advanced process control and gas handling capabilities, OXFORD Plasmalab 80 Plus is equipped with a sophisticated endpoint detection asset that enables real-time monitoring of the etching or ashing process. This model uses optical emission spectroscopy (OES) to detect the presence of specific chemical species in the plasma, allowing users to accurately determine the endpoint of the process and avoid overetching or underetching. Plasmalab 80 Plus is designed for ease of use and maintenance, with a user-friendly interface that allows for intuitive operation of the equipment. The system is also equipped with automated cleaning routines and diagnostic tools that help to ensure the long-term reliability and performance of the unit. Overall, OXFORD Plasmalab 80 Plus is a cutting-edge etcher/asher machine that offers unmatched versatility, precision, and efficiency in plasma processing. Whether used for semiconductor device fabrication, research, or other applications, this tool is sure to deliver high-quality results and meet the demanding requirements of modern plasma processing technologies.
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