Used OXFORD Plasmalab 90 Plus #9305326 for sale

ID: 9305326
Reactive Ion Etcher (RIE) Batch loadlock with 275 mm electrode Computer interface controls RF Generator: 13.56 MHz, 600 W Gases: Oxygen, Boron Tri-chloride, Chlorine, Nitrogen.
OXFORD Plasmalab 90 Plus is a versatile and reliable etcher/asher combination equipment. It is used for etching and ashing of samples with a combination of wet and dry etching. This system is well suited for etching and ashing of a wide range of materials including Si, GaAs, and InP. Plasmalab 90 Plus is equipped with two sources of power; a DC power source with a forward and reverse supply of up to 100A, and a RF source that can generate up to 500W. OXFORD Plasmalab 90 Plus etcher/asher has a fully automated operation with high precision of sample placement, transport and detection. This unit allows for accurate etching and ashing of samples up to 5" x 5", with a 6-axis motion control machine for accurate placement of the sample on the chuck. The chamber features CFC and FC based etching capability, with a wide range of selectable gases available for both types of etching. Plasmalab 90 Plus also features flexible gas delivery settings, with the possibility to program different sequence of gas flow and delivery pressure for different etching needs. The etching and ashing process is controlled with a fully integrated ARM (Automated Robotic Motion) tool, providing programmed recipes and accurate consistency of results in different samples. OXFORD Plasmalab 90 Plus is equipped with an advanced process monitoring asset to ensure accurate results. The Automatic Position Verification (APV) model allows for the automatic registration of the sample position, while the Automatic End Point Detection (AEP) equipment can detect the end of the etching or ashing process. Plasmalab 90 Plus offers a robust and reliable platform for etching and ashing of a wide variety of samples. Its accuracy, flexibility, and process control make it an ideal tool for micro-fabrication of semiconductor devices and other materials. The system is also suitable for deep silicon etching and ashing and other advanced processes.
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