Used OXFORD PlasmaPro 100 #293752371 for sale

ID: 293752371
Vintage: 2018
PECVD System Deposition lower electrode kit ADVANCED ENERGY / DRESSLER RF 600W Generator AMU Match INFICON 5T CM Gauge kit ALCATEL / ADIXEN / PFEIFFER A604H Pump kit Pump cable, 10 m Isolation valve ALCATEL / ADIXEN / PFEIFFER ACP 15D Dry pump kit Single wafer load lock kit Gas pod (8) Gas lines Gases: SIH4, NH3, GN2, CF4, N2O Mass Flow Controller (MFC) PC Monitor, 19" Power supply: 400 V, 3 Phase, 50 Hz 2018 vintage.
OXFORD PlasmaPro 100 is an industrial-grade etcher/asher specifically designed for etching and ashing processes in photolithography, mask repair, and microelectronic device fabrication. It works by combining RF energy with an oxidizing and etching gas atmosphere to induce a high temperature plasma that removes unwanted material from a substrate. The machine is capable of controlling both the chemical etching and physical etching of substrates as well as etching and ashing of films. The heart of PlasmaPro 100 is its advanced RF generator, which produces a high frequency signal with a range of up to 20MHz. This allows for precise and repeatable etching and ashing processes. The generator is connected to two independently adjustable RF antennas, one for the chemical etching process and the other for the physical etching process. All of these components work together to provide the user with a high level of control over the etching and ashing processes. The etching/ashing chamber of OXFORD PlasmaPro 100 can house two substrates at once and is capable of reaching temperatures between -25 to +40°C, enabling a wide range of materials to be etched and ashed. The chamber is also equipped with a mass flow controller to precisely control the pressure of the chamber and the flow of the etching and ashing gases. This further ensures process consistency and repeatability. Safety is of paramount importance with PlasmaPro 100 and the etching/ashing chamber is fitted with flow and pressure sensors to actively monitor the atmosphere within it. A safety interlock feature is also present to ensure the integrity of the chamber and noxious materials are not allowed entry into the workspace. OXFORD PlasmaPro 100 supports multiple substrate sizes from 1" x 1" up to 8" x 8". The feedthroughs for the RF cables and gas lines are all standard sizes, allowing for direct connection to a variety of substrates. The machine also features electrical signal feedback to allow for tighter process control, and a high-resolution display and intuitive user interface make operating the machine simple. Overall, PlasmaPro 100 is an extremely reliable and user-friendly etching/ashing machine. Its advanced RF generator, dual RF antennas, controllable chamber temperate and precisely controlled RF parameters make the machine well-suited for a wide range of etching and ashing processes.
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