Used OXFORD PlasmaPro 100 #293825087 for sale

OXFORD PlasmaPro 100 is a next-generation plasma etching and ashing equipment designed for advanced semiconductor device manufacturing. This cutting-edge equipment offers precise control and customization of plasma processes, making it an essential tool for research and development in the semiconductor industry. The system features a dual-frequency source, which allows for both inductively coupled plasma (ICP) and capacitive coupled plasma (CCP) modes. This dual-source configuration provides flexibility in process development, enabling users to adjust parameters such as power, gas flow rates, and pressure to optimize plasma conditions for specific etching or ashing applications. PlasmaPro 100 is equipped with a high-performance vacuum chamber, designed to maintain low base pressures and ensure stable plasma conditions during processing. The chamber is constructed from high-purity materials to minimize contamination and improve process repeatability. One of the key features of OXFORD PlasmaPro 100 is its advanced gas delivery unit, which enables precise control of multiple process gases. This machine allows users to create complex gas mixtures and pulsing sequences, facilitating a wide range of etching and ashing processes with high precision and repeatability. The tool also includes a state-of-the-art RF matching network, which ensures efficient power transfer to the plasma and maintains stable plasma conditions throughout the process. This feature is critical for achieving uniform and consistent etching results on various substrates, including silicon, III-V compounds, and dielectric materials. PlasmaPro 100 is equipped with a versatile electrode configuration, which supports both substrate bias and RF power applications. This flexibility allows users to implement a variety of plasma-enhanced processes, such as reactive ion etching (RIE), ion beam etching (IBE), and plasma-enhanced chemical vapor deposition (PECVD), to meet the diverse needs of semiconductor device fabrication. In addition to its advanced technical capabilities, OXFORD PlasmaPro 100 is designed for ease of use and maintenance. The asset features a user-friendly interface for programming and monitoring plasma processes, with real-time data logging and analysis tools to track process parameters and optimize performance. Safety features, such as interlocks and gas leak detection systems, are integrated into PlasmaPro 100 to ensure user protection and model integrity during operation. The equipment also complies with industry standards for equipment reliability and performance, making it a trusted tool for semiconductor fabrication facilities worldwide. Overall, OXFORD PlasmaPro 100 represents a technological breakthrough in plasma etching and ashing systems, offering unmatched control, flexibility, and precision for advanced semiconductor device manufacturing applications. Its innovative design, high-performance components, and user-friendly interface make it an indispensable tool for researchers and engineers seeking to develop cutting-edge semiconductor devices with superior quality and performance.