Used OXFORD PlasmaPro 100 #293828152 for sale

OXFORD PlasmaPro 100 is a versatile and highly advanced plasma processing equipment designed for etching and ashing applications in semiconductor manufacturing, MEMS (Micro-Electro-Mechanical Systems), and other microfabrication industries. This innovative tool incorporates cutting-edge technology to deliver precise, uniform, and repeatable processes essential for high-quality device fabrication. PlasmaPro 100 features a dual-source plasma configuration, consisting of both inductively coupled plasma (ICP) and dual-frequency capacitively coupled plasma (df-CCP) sources, providing a wide range of process flexibility and control. The ICP source generates a high-density plasma with excellent ion energy control, while the df-CCP source enhances ion uniformity and process stability. By combining these two plasma sources, the system can achieve superior process performance across a variety of materials and applications. One of the key advantages of OXFORD PlasmaPro 100 is its advanced process control capabilities, including real-time endpoint detection, power modulation, and gas flow control. The unit is equipped with state-of-the-art monitoring and feedback mechanisms that enable users to precisely tailor process parameters such as power, pressure, gas chemistry, and temperature to achieve the desired etch or ash results. This level of control ensures tight process uniformity, repeatability, and reproducibility, essential for achieving high yields in production environments. PlasmaPro 100 is equipped with a highly configurable process chamber that can accommodate various wafer sizes up to 200mm in diameter. The machine offers a wide range of process gases, including but not limited to CF4, SF6, O2, HBr, and Cl2, allowing users to etch a diverse range of materials such as silicon, silicon dioxide, silicon nitride, metals, and dielectrics. The tool's reliable gas delivery asset ensures precise and stable gas flows, essential for achieving consistent and reproducible results across multiple wafers. In addition to its advanced process capabilities, OXFORD PlasmaPro 100 offers a user-friendly interface with intuitive software control and monitoring features. The model's software allows for easy recipe creation, modification, and optimization, enabling users to quickly develop new processes or fine-tune existing ones. The equipment also features remote diagnostics and maintenance capabilities, facilitating efficient troubleshooting and maximizing system uptime. Furthermore, PlasmaPro 100 is equipped with advanced safety features to ensure user protection and compliance with industry standards. From interlock systems to gas leak detection sensors, the unit is designed to operate safely in cleanroom environments without compromising performance or reliability. The machine also offers comprehensive process data logging and reporting capabilities, allowing users to track process parameters, chamber conditions, and process outcomes for quality control and analysis purposes. Overall, OXFORD PlasmaPro 100 is a state-of-the-art plasma processing tool that offers unmatched flexibility, control, and performance for etching and ashing applications in advanced semiconductor and microfabrication industries. With its innovative technology, advanced process capabilities, and user-friendly interface, PlasmaPro 100 is an indispensable tool for achieving high-quality device fabrication and maximizing productivity in a production environment.