Used PLASMA TECHNOLOGY UDP80 #9126470 for sale

PLASMA TECHNOLOGY UDP80 (also known as an etcher/asher) is an advanced plasma surface etching and ashing technology. This technology is designed to be used in the semiconductor industry in the production process to produce high quality surfaces and devices. UDP80 uses a two-step method where the device is etched in pure Argon plasma and then ashed with a flow of nitrogen gas. This creates a surface that is free from contaminations, such as particles or organic molecules, and that has a uniform metal structure. The equipment is equipped with a low pressure and a high pressure ion sources, which allow for precise control of the plasma and ashing process. Additionally, the system offers a precision air-cooled BTM (beam forming tubular magnet) source, which significantly improves the etching and ashing quality. The BTM source has two parts, the active section and crystal section, with the active section consisting of the magnet and BTM field. This creates an even electric field that helps to get uniform etching and ashing over the entire surface. Furthermore, the unit can be integrated with a temperature controller, which allows it to etch at different temperature regimes. PLASMA TECHNOLOGY UDP80 can process semiconductor wafers up to 300 mm in size, with a plasma process rate of up to 90 wafers per hour. This makes it ideal for use in high volume production environments. Furthermore, the machine has low maintenance requirements, with easy access to the magnet and cleaner chamber for routine maintenance. Overall, UDP80 is an advanced etcher/asher tool specifically designed for the production of high quality surfaces and devices. It offers a two-step process, consisting of Argon plasma etching and nitrogen ashing, with a precision BTM source and temperature controller for uniform results. The asset can process up to 90 wafers per hour, with low maintenance requirements, and is ideal for high volume production.