Used PLASMATHERM 770 #9124177 for sale

Manufacturer
PLASMATHERM
Model
770
ID: 9124177
Wafer Size: 2-8"
Vintage: 1995
Reactive Ion etcher (RIE), 2"-8" Parallel plate type, 11" Upper electrode and lower electrode, 9" Multi-wafer size design up to 8" wafers Graphite feature plate Adjustable upper electrode height SEIKO / SEIKI STP-H300C Turbo pump SEIKO / SEIKI STP Controller (9) MFC's ADVANCED ENERGY RFPP 5S With AM5 matching network 290 Ion gauge controller MKS 286 Controller Disconnect box Plasmathem PC Power supply: 208 V, 60 A, 60 Hz, 3-Phase 1995 vintage.
PLASMATHERM 770 is an etcher / asher used by high-tech industries around the world for precision etching and ashing of various materials. The machine utilizes a combination of microwave energy and high-frequency plasma to etch and asher any material with effectively and accurately. 770 typically processes substrates ranging from 1" to 9" with various thicknesses. It utilizes a special patented chamber design to optimize the process for best etching and ashing results. The process is versatile since it can handle both coated and non-coated substrates of any thickness, size, shape and material. The model also incorporates two separate lids to ensure that no external contaminants enter the interior chamber of the machine. Once the substrate has been loaded into the machine, the process chamber is then sealed and pumped out to create a vacuum. This is done to remove any potential contaminants or oxygen concentrations inside the chamber. Then an RF generator is used to excite a rare gas mixture and a microwave field is generated to create plasmas. The chamber pressure of PLASMATHERM 770 is adjustable depending on user requirements and the desired etch rate. It also features an intelligent temperature control system that ensures the optimal process temperature is maintained regardless of changes in substrate types or etching processes. For added security, the device is also equipped with a built-in fire suppression system and has automatic cooling parameters. The plasma density of the etcher is also adjustable, further boosting its etch rates and cycle times. In addition to its etching and ashing capabilities, 770 also offers a variety of other features. It has an intuitive user interface and touch screen display to assist operators and users in loading and unloading substrates in the chamber. An EEPROM memory chip with a 2048MB capacity allows users to store prior program settings for future etching processes. PLASMATHERM 770 is designed to be a simple yet highly efficient etcher / asher. It is the perfect choice for high technology industries needing fast and accurate etching and ashing of various materials. With its intuitive design and easy-to-use features, 770 is the ideal choice for those looking for superior etching results.
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