Used PLASMATHERM 790 #293738215 for sale

PLASMATHERM 790 is a versatile plasma etcher/asher equipment designed for advanced etching, ashing, and film deposition processes in semiconductor manufacturing, MEMS (Micro-Electro-Mechanical Systems) fabrication, and research and development environments. This cutting-edge system offers precise process control, high uniformity, and excellent reproducibility, making it ideal for a wide range of applications requiring precise surface modification and material removal. 790 features a dual-frequency RF plasma source that provides a stable and highly uniform plasma density across the entire process chamber. This uniformity is essential for achieving consistent etching and ashing results on substrates of varying sizes and shapes. The unit is capable of handling substrates up to 200 mm in diameter, making it suitable for processing standard semiconductor wafers as well as larger substrates used in research applications. The plasma source in PLASMATHERM 790 can be operated in both continuous wave (CW) and pulsed modes, giving users the flexibility to tailor the plasma characteristics to suit their specific process requirements. The machine is equipped with a range of gas delivery options, including mass flow controllers for precise control of gas flow rates, and a showerhead gas distribution tool for optimal gas mixing and delivery to the processing chamber. One of the key features of 790 is its advanced process monitoring and control capabilities. The asset is equipped with a real-time endpoint detection model that allows users to precisely control the etch or ash process by monitoring key process parameters such as optical emission signals, RF power, and gas flow rates. This feedback control mechanism ensures that the process stops at the desired endpoint, preventing over-etching or under-etching of the substrate. PLASMATHERM 790 also offers a range of etch chemistries to accommodate various material types and process requirements. The equipment is capable of performing dry etching of silicon, silicon dioxide, silicon nitride, metals, and other materials commonly used in semiconductor device fabrication. Additionally, the system can be used for plasma ashing processes to remove photoresist and other organic contaminants from substrates prior to further processing. In terms of automation and process integration, 790 is compatible with advanced software packages that enable recipe management, data logging, and remote monitoring capabilities. The unit can be seamlessly integrated into multi-tool cluster platforms for high-throughput manufacturing environments, allowing for efficient transfer of substrates between process chambers without exposure to ambient conditions. Overall, PLASMATHERM 790 represents a state-of-the-art solution for advanced plasma etch and ash processes in semiconductor and MEMS applications. With its superior process control, high uniformity, and versatile capabilities, this machine is well-suited for both research and production environments where precise surface modification and material removal are critical for achieving high device performance and yield.