Used PLASMATHERM 790 #293775580 for sale
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ID: 293775580
Wafer Size: 4"
Vintage: 2005
ICP Etcher, 4"
Lower electrode, 11"
PC
Operating system: Windows 98
2005 vintage.
PLASMATHERM 790 is a cutting-edge plasma etcher/asher equipment designed for precise etching and cleaning of semiconductor and other materials in a research or production environment. This high-performance tool is equipped with advanced technology to deliver superior process control, uniformity, and repeatability, making it an ideal choice for a wide range of applications in the semiconductor, MEMS, nanotechnology, and other industries. 790 features a sophisticated plasma processing chamber with a high-density plasma source, typically utilizing inductively coupled plasma (ICP) technology, which generates a highly reactive plasma that effectively etches and cleans the surface of the substrate. The system is capable of handling various wafer sizes up to 200mm and offers a customizable configuration to accommodate different process requirements. One of the key highlights of PLASMATHERM 790 is its advanced process capabilities, including both etching and ashing functionalities. Etching is a critical process in semiconductor manufacturing, used to selectively remove material layers from the surface of a wafer to create patterns, trenches, or vias for device fabrication. 790 offers precise control over the etch rate, selectivity, and profile of the etched features, allowing users to achieve high-precision patterning with sub-micron resolution. In addition to etching, PLASMATHERM 790 can also function as an asher, which is used for removing organic contaminants, photoresist residues, or other unwanted materials from the wafer surface after the etching process. The asher module in the unit utilizes a combination of plasma and reactive gases to efficiently clean the substrate without damaging the underlying layers, ensuring the quality and reliability of the final device. 790 is equipped with a range of advanced control features to optimize process performance and ensure consistent results. The machine includes a highly configurable gas delivery tool, precise RF power control, temperature control, and pressure regulation to tailor the plasma process parameters according to the specific requirements of the application. Additionally, the asset is integrated with advanced endpoint detection capabilities to accurately monitor the progress of the etching or ashing process in real-time, enabling precise process termination and endpoint control. Moreover, PLASMATHERM 790 offers a user-friendly interface with advanced software control for easy operation and monitoring of the process parameters. The model allows users to create and store custom process recipes, perform automatic process optimization, and generate detailed process reports for analysis and documentation. The advanced data logging and analysis tools enable users to track process parameters, monitor equipment performance, and identify any potential issues for troubleshooting and optimization. Overall, 790 is a state-of-the-art plasma etcher/asher system designed to meet the demanding requirements of modern semiconductor and materials processing applications. With its advanced technology, superior process control, and versatility, PLASMATHERM 790 offers a reliable solution for high-precision etching and cleaning processes in research, development, and production environments.
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