Used PLASMATHERM Dual chamber 730/720 RIE #9123973 for sale

ID: 9123973
Wafer Size: 3-8"
Vintage: 1994
Ion etcher, 3"-8" RIE Substrate electrode, 11” MKS 286 flow controller Plasmatherm windows based OS (2)MKS Ion gauge controllers 290 Advanced energy RF5S power supply AM502 matching network Leybold 361C turbo Gas distribution center (5) MKS Mass flows 3 phase, 30A 1994 vintage.
PLASMATHERM Dual Chamber 730/720 RIE is a versatile and powerful etching and ashing tool. It is capable of creating intricate features of various shapes and depths on complex and detailed surfaces. Designed for processing a wide range of materials, it is ideal for applications in microelectronics, MEMs and optical components fabrication. This machine uses a combination of both reactive ion etching (RIE) and radio frequency plasma to etch and/or asher materials of different shapes and sizes. It provides a precise control of processing time and pressure, allowing a high throughput of parts with superior results. It is composed of two processes in a dual chamber equipment. Firstly, the RF plasma chamber is used to create a uniform temperature profile and uniform etching rate over the wafer surface. Secondly, the RIE chamber is used to polymerize and concentrate the ions on the surface. This dual chamber system ensures maximum performance and uniformity for each task. The 730/720 RIE consists of a vacuum chamber, an RF power generator, a process gas inlet and a controlled pressure unit. The chamber is designed to hold wafers up to 8" and has an electrostatic chuck to accurately hold the wafers in place. The deep etching process takes place inside the chamber, eliminating material contamination from the environment. The RF power generator allows for superior etching controls and precise timing of etch lengths. The generator also allows the user to adjust the RF power generated in order to optimize the etching rate and create intricate detailed structures. Additionally, the process gas machine allows for different gases to be mixed, providing more variety for etching different types of materials. The Dual Chamber 730/720 RIE offers unparalleled capability and precision, providing the highest quality etching and ashing results available. With its combination of RF and RIE technology in a dual chamber design, it is the perfect tool for complex applications and precise etching tasks.
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