Used PLASMATHERM PT530 PECVD #9123992 for sale

ID: 9123992
Vintage: 1986
PECVD Deposition system RF Plasma model HFS-801S RF Power supply (800W-13.56Mhz) Model: AMN-501 500w-13.56 RF Plasma mode SEV1DC DC power supply (DC bias) Vacuum general model 80-6A and 80-2 pressure controller Leybold model 28725 V3 (5) Process gases: Nitrous oxide Nitrogen 208 V, 3 phase 1986 vintage.
PLASMATHERM PT530 PECVD is a plasma etcher/asher which utilizes radio frequency (RF) technology in order to deposition thin films and etch them. It can be used to deposit and etch a wide variety of materials, such as metals, oxides, nitrides, and polymers. The machine can be used for a variety of industries including medical,... electronics, optoelectronics, semiconductor, and solar energy. PT530 PECVD allows for rapid and precise plasma etch processes, with high uniformity. The equipment is capable of producing a low pressure (0.3 - 0.6 torr), low power (50 W - 500 W), a wide range of plasma gas species, and a high uniformity across substrates. Long plasma lifetime, low power, and optimized capability for chamber cleaning are all achieved by the use of high-efficiency magnetron technology. PLASMATHERM PT530 PECVD has multiple etch/deposition sources such as highpressure planar magnetrons, inductively coupled plasma, and parallel plate, as well as effortless wafer capability. Additionally, the system is designed for high throughput, with optimized source-to-wafer distance, automated gas exchanges, and variable gas flow management. PT530 PECVD enables a wide range of standard deposition and etching processes: low temperature CVD for metals, oxide and nitride deposition, high temperature CVD processes, oxide etching, dry etching, and reactive ion etching (RIE). The unit is highly versatile, with the ability to perform RIE, sputtering, metallization, and anisotropic etch processes. The machine is also capable of deposition and etching of polymers, as well as semiconductor deposition and selective etching of oxide/nitride layers. The tool also offers advanced process control capabilities, with a range of process parameter settings allowing users to fine-tune processing to meet their exact requirements. Advanced process diagnostic tools are also included, featuring an ambient pressure diagnostic port and real-time imaging. This makes it easier for users to identify and address any problems that arise during the process. In conclusion, PLASMATHERM PT530 PECVD is a powerful plasma etcher/asher with the ability to deposit and etch a wide range of materials and to achieve precise, uniform etch results. Its multiple source capabilities enable the user to carry out a wide range of processes, while its advanced process control and diagnostic tools make it easier to maintain and troubleshoot the asset.
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