Used PLASMATHERM SLR 770 MF #293763704 for sale

ID: 293763704
Vintage: 2009
Etcher Wafer stage: 100 mm Plasma source: ECR Frequency: 2.4 GHz Gases: SF6, CF4, CHF3, N2, Ar, H2, O2 2009 vintage.
PLASMATHERM SLR 770 MF is an advanced plasma etcher/asher equipment designed for high-performance semiconductor etching and resist stripping applications in the semiconductor industry. This system incorporates state-of-the-art technologies to deliver precise and reproducible etching and ashing processes essential for semiconductor device fabrication. The combination of plasma etching and asher functionalities in a single unit makes SLR 770 MF a versatile tool for a wide range of applications in the semiconductor manufacturing process. At the core of PLASMATHERM SLR 770 MF is its superior plasma generation and control capabilities. The machine utilizes a high-density inductively coupled plasma (ICP) source to generate a highly reactive plasma consisting of ions, radicals, and neutral species. This plasma is essential for etching and ashing processes as it enables the removal of material from the semiconductor wafer surface with high selectivity and precision. The ICP source in SLR 770 MF is characterized by its stability and uniformity, ensuring consistent process results across the wafer. PLASMATHERM SLR 770 MF features a sophisticated gas delivery tool that allows precise control of the process gases used in the etching and ashing processes. The asset supports a wide range of gases, including fluorine-based chemistries commonly used in plasma etching processes. The gas delivery model enables accurate flow rate control and mixing of gases to achieve the desired process conditions, such as etch rate, selectivity, and uniformity. Additionally, the equipment is equipped with advanced mass flow controllers and pressure regulators to ensure repeatable process conditions from run to run. For etching applications, SLR 770 MF offers a range of etch chemistries and process recipes to meet the specific requirements of different semiconductor device structures. The system is capable of high-resolution pattern transfer processes with high aspect ratio features, thanks to its superior etch rate control and sidewall profile uniformity. The etching process is monitored and controlled in real-time using advanced endpoint detection techniques to ensure precise control over the etch depth and uniformity across the wafer. In addition to its etching capabilities, PLASMATHERM SLR 770 MF also serves as a high-performance asher for resist stripping and surface cleaning processes. The unit features a dedicated plasma ashing chamber with optimized process conditions for removing photoresist and other organic contaminants from the wafer surface. The asher functionality of SLR 770 MF is essential for post-etch cleaning and preparation of the wafer for subsequent process steps, such as deposition or lithography. Overall, PLASMATHERM SLR 770 MF is a versatile and reliable plasma etcher/asher machine that meets the stringent requirements of the semiconductor industry for advanced device fabrication processes. With its advanced plasma generation and control capabilities, precise gas delivery tool, and customizable process recipes, SLR 770 MF provides semiconductor manufacturers with a powerful tool for achieving high-quality etching and ashing processes essential for producing next-generation semiconductor devices.
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