Used PLASMATHERM SLR 770 RIE #293753769 for sale

ID: 293753769
Vintage: 1994
Etcher Chamber 1: CF4, CHF3, O2, H2 Chamber 2: O2, Cl2, Bcl3, HBr (2) Turbo pumps Vacuum pump 1994 vintage.
PLASMATHERM SLR 770 RIE is an advanced reactive ion etching (RIE) equipment designed for precise and efficient micro- and nanofabrication processes. Developed by Plasma-Therm, a leading manufacturer of plasma processing equipment, SLR 770 RIE offers unparalleled performance in etching and ashing applications for a wide range of materials and substrates. This cutting-edge tool integrates innovative technologies to deliver high-quality results in semiconductor device manufacturing, MEMS fabrication, and other research and development applications. One of the key features of PLASMATHERM SLR 770 RIE is its versatile process capabilities, which enable users to etch a variety of materials with high selectivity and uniformity. The system utilizes a combination of reactive gases, plasma chemistry, and RF power to create anisotropic etch profiles with precise control over etch depth and feature size. This makes it ideal for patterning and structuring substrates at the micro- and nanoscale level, achieving sub-micron resolution and high aspect ratio features. SLR 770 RIE is equipped with a high-power RF generator that delivers precise control over plasma density and ion energy, enabling users to tailor the etch process to their specific requirements. The unit also features a sophisticated gas delivery machine with recipe-driven process control, allowing for easy optimization of process parameters and reproducibility of results. Additionally, the chamber design and pumping tool of PLASMATHERM SLR 770 RIE ensure high process stability and low particle contamination, leading to consistent and reliable etching performance. In terms of plasma generation and control, SLR 770 RIE employs advanced technologies such as inductively coupled plasma (ICP) and electron cyclotron resonance (ECR) to create a stable and uniform plasma discharge. This enables efficient ionization of reactive gases and precise control over ion flux and energy distribution at the substrate surface, resulting in highly anisotropic etching profiles and minimal sidewall damage. The asset also incorporates advanced endpoint detection technology to monitor the etch process in real time and ensure accurate process control and endpoint determination. PLASMATHERM SLR 770 RIE is equipped with a range of advanced diagnostics and monitoring tools, including optical emission spectroscopy (OES), mass spectrometry, and ellipsometry, to characterize the plasma chemistry and etch process in situ. These capabilities allow users to optimize process parameters, troubleshoot issues, and ensure consistent etch results across multiple wafers and process runs. The model also features a user-friendly interface with intuitive software control and data logging capabilities, enabling easy operation and data analysis for users of all experience levels. Overall, SLR 770 RIE is a state-of-the-art reactive ion etching equipment that offers superior performance, versatility, and ease of use for a wide range of micro- and nanofabrication applications. With its advanced process capabilities, precise control over plasma parameters, and robust chamber design, PLASMATHERM SLR 770 RIE is an indispensable tool for researchers, engineers, and manufacturers seeking to achieve high-quality etching and ashing results in their semiconductor and MEMS projects.
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