Used PLASMATHERM SLR 770 #9280190 for sale
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ID: 9280190
Wafer Size: 3"
Vintage: 1997
Ion Coupled Plasma (ICP) system, 3"
Single chamber
Etcher with load lock SLR transfer load
700 Chamber
Electrodes
Loadlock
Source RF
Bias RF
Chiller
Ion gauge and controller
Distribution centers:
RPPP - RF5S / RP10 Power supply
With matching network / Equivalent
(6) Zones chamber controllers
Turbo pump and controller
Gate valve
Operating system: Windows
Flat panel LCD
Keyboard
Mouse
Set up for semi standard
SiC Wafers, 3"
Sapphire carriers, 4"
Ceramic clamp for single, 4"
He Backside cooling based, 4"
Gas distribution boxes:
(4) MFCs with gas lines for Chlorinated process
IPC System set up for Fluorine based chemistry
ICP System set up for Chlorine based chemistry
(2) Bypass valve lines per system
Heat exchanger: 208 V, 60 Hz
Dry pump: 208 V, 60 Hz
Power supply: 208 V, 60 Hz, 3 Phase
Manuals included
1997 vintage.
PLASMATHERM SLR 770 is a state-of-the-art dry etch and ashing equipment designed to be used in the semiconductor industry for precision etching and ashing. The system is based on the Pulsed Glow Discharge (PGD) technique and has been designed to provide reliable and repeatable etching parameters. The unit has been developed to be used in a wide range of etching and ashing applications, including wafer etching, metal etching, insulation etching, and wet etching using a variety of different gas mixtures. The machine features a powerful 13.56 MHz RF power supply, integrated temperature controller, and multiple max. 80 W gas guns making it suitable for a variety of process gases for various etching and ashing applications. The tool's process gas asset is capable of injecting numerous mixture gas combinations for precise process control. The model can support up to 8 sequential process steps, along with up to 5 independent gas flow controllers suitable for nitrogen, oxygen, hydrogen, argon, FREA3, chlorofluorocarbon, or other types of inactive gases. With support for up to 8 combinations, users can easily produce optimized process parameters for many etching and ashing applications. SLR 770 features a powerful 24/7 maintenance-free operation which eliminates any downtime and extended maintenance intervals. The equipment also features a user-friendly graphical user interface (GUI), which includes recipe and runtime management, statistical process control (SPC), and process parameters visualization, providing users with a comprehensive control system for their etching and ashing processes. At the core of PLASMATHERM SLR 770 is the SLR-20X advanced vacuum package. This advanced vacuum package features up to III to IV grade vacuum and has been designed to produce a clean etch environment. The SLR-20X package also features a flat top chamber to prevent material accumulation, along with constant RF matching networks which ensure precise and repeatable etch results and reduce etch time. SLR 770 is a great choice for any etching and ashing application. This advanced unit is easy to use and provides reliable and repeatable process parameters for many types of etching and ashing applications. With advanced features such as powerful RF power supply, integrated temperature controller, and multiple max. 80 W gas guns, users can be sure they have a machine which offers the highest in etch accuracy and repeatability, making it the perfect choice for any etching and ashing process.
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