Used PLASMATHERM SLR 770 #9407588 for sale
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ID: 9407588
Wafer Size: 6"
Inductively coupled Plasma (ICP) Etcher, 6"
Controller type: PC
Upgraded ICP Process Module (PM)
High power ICP Applicator
Lower electrode, φ 10"
Ceramic wafer clamp
Helium backside cooling
Load lock chamber with linear robotic arm
Load lock arm with programmable stepper motor and controller
Gas distribution box with 4 Gas channels
MKS 1479 Metal sealed mass flow controllers
Option: 4 Gas channels
(2) RFPP AMNPS-2A Auto matching network controllers
RFPP RF5S RF Generator: 500 W at 13.56 MHz
RFPP AMN-5 500 W Auto matching network
RFPP RF20M RF Generator: 2000 W at 2.0 MHz
RFPP AMN-20 2KW Auto matching network
SHIMADZU TMP1003 MAG LEV Turbo pump with controller
VAT 64 Rectangular throttle valve with VAT PM5 Controller
INFICON MPG500 Ion gauge on ICP Chamber
MKS 325 Moducell Pirani gauge on load lock
WATLOW Three zone chamber heater controller
EDWARDS QDP80 Dry roughing pump on process module
AGILENT DS 302 Mechanical pump on load lock
SMC HRR018 Rack mount chiller; 5°C - 45°C Temperature range
Analog and Digital I/O Modules controlled by BECKHOFF Ethernet I/O Via Modbus TCP/IP Communications protocol
Pneumatic valves controlled by SMC Modules via Modbus TCP/IP Communications protocol
PC:
UBUNTU LINUX OS
Intel I7 CPU at 3.4 GHz
16 GB RAM
500 GB SSD
SMC Pneumatic valves
Standard flat panel monitor, 2"
Keyboard
Mouse
Electrical disconnect box - 208 VAC, 60 Hz, 3-Phase.
PLASMATHERM SLR 770 is a single-wafer plasma etcher/asher and is one of the most advanced models available on the market. It offers a unique combination of features that enable users to clean, etch, and asher various substrates with unprecedented levels of precision. The machine is equipped with a range of features that enable it to operate as both an etcher and asher. It is capable of controlling the etching and ashing process with an accuracy of up to 0.1 μm thanks to its advanced mass flow controller and embedded data logging system. The machine has a programmable process gas supply. This makes it possible for users to optimize the etching and ashing parameters for a particular application and to switch between etching and ashing in the middle of the process. The machine also boasts a truly remarkable level of precision. It has an oxygen abundance and cleaning accuracy of up to 0.001%. The machine also has a very powerful ion beam that allows it to etch, asher and clean with a very high degree of control. The machine is designed with safety in mind and has a closed-loop process chamber that ensures a high level of safety. The chamber also features an acoustic-dampening design and is able to hold a vacuum at up to 760 mbar and the operating pressure is adjustable. The machine is also very cost effective. It is able to etch and asher quickly and efficiently, and its running costs are very low compared to other models on the market. Overall, SLR 770 is an advanced machine that is a great choice for any etching or ashing process. Its combination of accuracy, safety, and cost-effectiveness makes it an ideal choice for precise and efficient etching and ashing.
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