Used PLASMATHERM / UNAXIS 790 #9116459 for sale

PLASMATHERM / UNAXIS 790 is a plasma etching and ashing equipment specifically designed for production of high resolution MEMS parts. The system has a closed loop unit to ensure the highest quality of etching and ashing, resulting in products that are precisely shaped and have extremely small features. The etcher has a multi-axis wafer transfer machine that enables precise handling and positioning of the wafer being etched/ashed. It also has a robotic transfer tool for efficient and human-free loading of the wafer and unloading of final product. The etching asset utilizes a standard IntelliFlow and Software Process Control Model, allowing for easy and accurate process control over etching and ashing times. The magnetically enhanced RF energy source provides several different power levels, making it highly efficient in creating different etching profiles on the wafer. The equipment can also be tuned to create different profiles of etching and ashing. UNAXIS 790 uses patented technology to create an exhaust system for strong exhaust flow and optimized process throughput. The wafers being etched/ashed are put into a vacuum chamber, with low pressure and high temperature in the 75 to 2.75 torr range. The magnetically enhanced RF source is then responsible for creating the high energetic plasma, which then continues to etch and ashing the wafer. The etched material is then collected and transferred away. The unit provides a variety of features, including dry and wet process, hard-mask compatible, variable pressure capability, precision wafer handling, and multiple process control features. This makes the machine a highly efficient and reliable solution for production of high resolution MEMS products. PLASMATHERM 790 provides excellent process repeatability, uniformity, and product yields. The tool is also designed to fit in any high volume production environment. All process parameters, such as pressure, temperature, and voltage, are monitored and controlled automatically by the asset, ensuring the highest process quality. This also allows for highly precise etching/ashing of wafers to be produced.