Used PLASMATHERM / UNAXIS SLR 730 #293585536 for sale

ID: 293585536
Wafer Size: 8"
Vintage: 2000
PECVD System, 8" Dual chamber Load locked (2) Carrier plates EDWARDS IQDP80 Vacuum pump with blower VARIAN Scroll vacuum pump: Load lock NESLAB HX-75 Chiller Electrical breaker box EMO Buttons RFPP RF5S RF Generator, 13.56 Mhz, 500 W Substrate maximum temperature: 350°C Temperature controller Power controller Manuals Gas box: MKS 1479A Mass Flow Controller (MFC) Size / Gases 1000 SCCM / N2 20 SCCM / NHS 1000 SCCM / N2 2000 SCCM / N2 2000 SCCM / N2 200 SCCM / (5) SIH4 20 SCCM / NHS RANGE / 1000 SCCM / N2 2000 SCCM / N2 2000 SCCM / N2 300 SCCM / C3F8 Power supply: 208 V, 3-Phase, 60 Hz 2000 vintage.
PLASMATHERM / UNAXIS SLR 730 is an etcher/asher which provides an ideal equipment for applications in semiconductor device manufacturing. This etcher is built for cleanroom operation with fully automated process control and is capable of processing substrates up to 200mm by 200mm. The system includes multiple etching and ashing technologies such as inductively coupled plasma (ICP) etching and oxygen plasma ashing. It is equipped with a 15-position geometrical handling unit, allowing for rapid and precise sample positioning. UNAXIS SLR 730 utilizes an ICP source for etching and includes an optional integrated remote source. This configuration enables higher ion energy, longer plasma lifetimes, and lower power consumption than other DC sulfur source etch processes. Additionally, the ICP source allows for precise control of etch parameters such as etch rate and selectivity. The machine also features load-locked inert gas sources, enabling fast changeover and minimal contamination. The load-locked idea, along with the integrated remote source, makes it possible to run multi-step processes in a single tool. Furthermore, the tool offers precise temperature control and provides repeatable and uniform thickness etching. The asset is also capable of etching and ashing wafers to precise depths while maintaining a good surface morphology. PLASMATHERM SLR 730 is pre-calibrated and ready to run without additional setup. The model is compatible with all common process gases, with an optional wafer exchange equipment for quick wafer-to-wafer transitions. The etcher offers precise control of both the etch and ashing processes and is available with an array of options, including an online and integrated mass spectrometer and advanced end-point detection. This enables high-quality, repeatable processing results. The system also features robotic handling, multiple process chambers, and a fully graphical user interface. Overall, SLR 730 is an exceptional etcher/asher. Providing automated process control and an integrated remote source; this high tech unit is capable of precise etching and ashing of substrates up to 200mm and is equipped with multiple etching/ashing technologies as well as a 15-position geometrical handling machine, allowing for rapid and precise sample positioning. With its ability to run multi-step processes, PLASMATHERM / UNAXIS SLR 730 is an ideal tool for semiconductor device manufacturing.
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