Used PLASMATHERM / UNAXIS SLR 740 #9224550 for sale

PLASMATHERM / UNAXIS SLR 740
ID: 9224550
System.
PLASMATHERM / UNAXIS SLR 740 is an etcher/asher that is designed with higher productivity, superior stability, and better yield through its use of high-precision control and an advanced process sequencing equipment. This etcher/asher is capable of processing a wide range of both simple and complex substrates at fast rates up to 18,000 wafers per hour. It is capable of achieving excellent results for etching and post-etch cleaning processes. UNAXIS SLR 740 features an innovative "dual-axis" design that combines two rotating stages to ensure ideal end results. This dual-axis design reduces torque and vibration, improving the precision of the etch process and providing high accuracy for more delicate substrates. With its highly accurate pattern definition, PLASMATHERM SLR 740 ensures superior pattern transfer and response time. Control of the etch depth is precisely managed with its advanced process control system. SLR 740's electro-optic unit also uses advanced impedance technology to continuously monitor the etch process. This machine detects both particle and gas defects on the wafer substrates and automatically adjusts the etch time, gas flow rate, and batch size to provide superior process control. PLASMATHERM / UNAXIS SLR 740 also features an RF generator that uses plasma activation to improve etch rates and yields. The RF generator is programmable to achieve both high etch rates and low process temperatures, which minimizes both wafer damage and conformational changes due to thermal expansion. UNAXIS SLR 740 also includes an advanced heating management tool that allows users to set both chamber and substrate temperatures to ensure optimal performance. PLASMATHERM SLR 740 strongly reduces temperature fluctuations and process fluctuation to achieve higher yields and better repeatability even during long etching processes. Overall, SLR 740 is an ideal etcher/asher for processing high precision substrates and materials with minimal setup times and improved yields. Its dual-axis design, advanced process control asset, and RF generator provide superior process control and optimal etch rates for excellent end results.
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