Used PLASMATHERM / UNAXIS SLR #9250539 for sale

PLASMATHERM / UNAXIS SLR is an advanced etching and ashing equipment designed for high end applications from UNAXIS company. It is a high performance dry etching tool with a multi-chamber design and multiple etching and ashing systems. It has a high vacuum chamber that allows for the deposition and etching of various materials to form intricate structures and patterns. The tool also has a high speed multi-stage planarizing system to control the spacing between lines and create precise patterns in order to shorten processing times. It also features the ability to change etch and ashing times and processes quickly, to optimize process performance. The chamber can be marked up with multiple etching and ashing systems, all of which are capable of operating at high pressure and temperature. By doing this, the unit is able to apply different etch and ashing processes to different wafers and substrates. The machine is also able to apply multiple etch steps, to create high resolution patterns with intricate structures. With the combination of a powerful gas tool and advanced optical systems, the asset is able to etch and ashy materials with low defects rates and high reproducibility and uniformity. The model can also apply processes at the highest pressures and low temperatures to avoid overheating and oxidation. The equipment can apply various etch and ashing processes to materials such as single and double-sided substrates, LCDs, films, metals and others. It also has an automated run-to-run system and error correction unit which can improve the productivity of the etch/ash process. UNAXIS SLR also comes with a high-end wafer alignment machine to ensure precise alignment of the substrate which is crucial for high resolution patterns. Overall, PLASMATHERM SLR is an advanced etching and ashing tool that can be used for a wide variety of applications, from etching complex and intricate patterns to ashing LCDs, films, metals and more. It also has the ability to process at high pressures and low temperatures, and has automated wafer alignment and run-to-run systems, ensuring accurate and repeatable processes and high productivity.