Used PLASMATHERM VLR 700 #293807118 for sale

PLASMATHERM VLR 700
Manufacturer
PLASMATHERM
Model
VLR 700
ID: 293807118
Wafer Size: 8"
Dry etcher, 8".
PLASMATHERM VLR 700 is a cutting-edge plasma etcher and asher equipment designed for advanced semiconductor manufacturing processes. This highly versatile tool is equipped with a range of innovative features and capabilities that enable precise material removal, surface cleaning, and pattern transfer in semiconductor fabrication. With its superior performance, flexibility, and reliability, VLR 700 is widely used in research and development labs, universities, and semiconductor production facilities. The key components of PLASMATHERM VLR 700 include a vacuum chamber, gas delivery system, RF power supply, electrode assembly, temperature control, and software interface. The vacuum chamber is made of high-quality materials to ensure a clean and stable processing environment. The gas delivery unit allows for precise control of etchants, reactants, and cleaning gases, while the RF power supply generates the plasma needed for material processing. The electrode assembly in VLR 700 is designed for uniform plasma distribution and efficient material processing. The machine can accommodate various types of substrates and sample sizes, making it suitable for a wide range of applications. Temperature control features enable users to optimize process parameters and ensure consistent results. One of the key capabilities of PLASMATHERM VLR 700 is its ability to perform both etching and ashing processes. Etching is a process used to selectively remove material from a substrate, while ashing is used to remove organic residues and contaminants from surfaces. With this dual capability, users can perform a wide range of material processing tasks with a single tool. VLR 700 offers a range of plasma etching modes, including reactive ion etching (RIE), deep reactive ion etching (DRIE), and high-density plasma etching. Each mode is optimized for specific materials and process conditions, allowing users to achieve high etch rates, selectivity, and uniformity. The asset can also be used for isotropic etching, anisotropic etching, and other specialized etching techniques. In addition to etching capabilities, PLASMATHERM VLR 700 is equipped with advanced ashing features for surface cleaning and preparation. Ashing processes can be tailored to remove photoresist, polymer residue, and other organic contaminants from substrates. The model offers precise control over ashing parameters, such as gas flow rates, pressure levels, and plasma power, to ensure optimal cleaning results. VLR 700 is controlled by user-friendly software interface that allows for easy programming, parameter adjustment, and process monitoring. The equipment can store multiple process recipes for quick and efficient setup of standard processes. Real-time data logging and analysis capabilities enable users to track process performance, troubleshoot issues, and optimize process parameters for improved results. Overall, PLASMATHERM VLR 700 is a state-of-the-art plasma etcher and asher system that offers advanced capabilities for semiconductor manufacturing and research. With its high-performance features, dual processing modes, and user-friendly interface, this tool is a valuable asset for semiconductor labs and facilities seeking precision, reliability, and flexibility in material processing applications.
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