Used PSK TERA 21 #9259689 for sale

Manufacturer
PSK
Model
TERA 21
ID: 9259689
Asher, 12" (2) Chambers EFEM Transfer Module (TM) Process Module (PM) AC Rack Cables 2004 vintage.
PSK TERA 21 is one of the most advanced etchers/ashes available on the market. It is an innovative solution for the chemical etching and ashing process for the development of fine and ultra-fine features. This equipment is capable of producing large volumes using a small footprint. TERA 21 is equipped with a wide range of adaptable process enhancement features such as high thermal stability, high speed etching and ashing with precise pressure and temperature control, providing a reliable way for achieving fast cycle times and repeatable results. The system features a stress-free vacuum-oven chamber design and multi-zone temperature control which can etch and ashen materials with precision and accuracy. All settings, parameters, recipes and processes can be presaved and reused in a matter of minutes for reliable and efficient etching. The unit uses inert gas backfilling and high temperature to prevent oxidation and contamination of the etched surface. The etcher/asher utilizes a special gas-wash machine to prevent any heavily oxidized particles from passing out of the heater chamber. PSK TERA 21 enables ultra-fine selectivity which is critical for processing today's complex micro-sized ICs. It supports a wide range of different materials including high temperature alloy, TiN/TiWN, Au/Ti, Al/Ti and other precious metals. The ability to operate at high temperatures allows for processing of high-aspect-ratio, deep and/or narrow structures and complex 3D microstructures. The tool features embedded controllers, operation software, and timers, enabling the full automation of the etching process. This asset is designed for easy operation and maintenance, and it can be connected to a network for monitoring and process data transfer. TERA 21 is capable of producing high-cycle repeatable results, making it an ideal choice for research and production, giving a maximum etching capability and precision for the successful development of fine and ultra-fine features.
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