Used PSK TERA 21S #9241274 for sale

PSK TERA 21S is a state-of-the-art etcher/asher manufactured by PSK Technologies. It is designed for processing high-end wafers and other thin materials such as silicon dioxide and polyimide. It is especially well-suited for applications involving state-of-the-art semiconductor fabrication, MEMS, and microsystems. The equipment features a PLC (Programmable Logic Controller) interface for easy integration into a variety of automation systems. TERA 21S is designed for production-level substrate processing in the 200mm and 300mm wafer dimensions. It utilizes a linear scan with staggered steps for even distribution of etch/ash across the substrate. An automatic pre-aligner enables repeatable alignment of position and orientation for all batches. A multi-tin non-contact, no-gas plasma source provides uniform etch/ash deposition conditions across the wafer. The system is also equipped with a five-step sequential shutoff unit to ensure reliable electrical characteristics are maintained. PSK TERA 21S is well-suited for use in a continuous batch processing scenario. It has several features such as adjustable process rates, chlorine-free NF chemistry, and plasma arc welding (PAW) capabilities. It also has an online measurement capability that allows for real-time adjustment of process parameters. This allows for quick and easy calibration of the machine for optimal results. TERA 21S also includes a high-throughput handling robot, which is designed for quick and accurate substrate loading and unloading. This robot has a pattern recognition-based motion tool, which saves time and reduces errors. The robot also has an active metal-ion filter, which helps ensure high-quality etch/ash results. The asset also has high temperature capabilities with a temperature range of -20 to +250°C. PSK TERA 21S is fully compatible with ISO-9002 and SANTON certification, ensuring high-quality etch/ash results. With its fast run-times, configurable programmable logic, an automated pre-aligner, and its multi-tin non-contact, no-gas plasma source, the model is an ideal choice for high-precision etching/ashing of wafers and other thin materials.