Used PSK Ultima III #9083216 for sale

PSK Ultima III is an etcher / asher from Plasma-Therm that uses inductively coupled plasma technology to enable a variety of critical materials processing capabilities. It is the first production etcher / asher to integrate inductively coupled plasma processing, delivering an optimal combination of short high density plasmas with increased ion energy. Ultima III features a robust design to ensure high availability and high reliability processing of applications such as non-photo resist strip, descum removal, RIE (Reactive Ion Etching), and ICP-CVD (Inductively Coupled Plasma-Chemical Vapor Deposition). It combines the advantages of previous technologies, such as improved etching uniformity and depth control, enabling users to process a wide variety of types, layers, sizes, and designs of matertials. The etching window of PSK Ultima III employs inductively coupled plasma (ICP) technology to produce short, high density plasmas with increased ion energy and densities. This helps increase etching rate, yields and selectivities, minimize contouring and increase depth control, and reduce redeposition of material. The etching window consists of an RF electrode and its water-cooled vacuum-sealed upper electrode. The source power delivered via the ICP source is kept in a tightly controlled energy range through the use of modulated radio frequency power. This source power is then converted into ions, which are then accelerated by a bias voltage and directed at the substrate. The ICP source can generate short high density plasmas with increased ion energy and densities at transistor level precision. This allows for increased etching rate, yields and selectivities, minimized contouring and increased depth control, and reduced redeposition of material. The chamber design of the etching window is compact enabling improved accessibility for substrate handling. It also uses lower purge gas requirements and incorporates a unique feature that optimizes the safety of any processing sequences by limiting the power during the start-up process. The substrate holder and electrode assembly are designed for precise adjustment of the etching window parameters and processes, allowing for precise control over chamber pressure, gas flow rates, and substrate power. The substrate holder assembly also includes a robust automated mechanism for substrate handling, enabling reliable substrate positioning and exchange, without human intervention. Ultima III is designed to be used in both standalone and integrated vacuum systems with superior remote control capability. The control program is designed to provide seamless integration with both manual and automatic process control. A user-friendly graphical user interface for data acquisition, control and analysis provides for easy setup and optimization of recipe parameters. The software also is capable of communication with SCADA systems, providing real-time feedback on system status, performance, and process data. In summary, PSK Ultima III is an etcher / asher from Plasma-Therm that uses inductively coupled plasma (ICP) technology to enable precision processing of certain materials. Features of the device include a sophisticated RF electrode and water-cooled vacuum-sealed upper electrode, an ICP source that can generate short high density plasmas with increased ion energy and densities, a compact chamber design, improved accessibility for substrate handling, a robust automated mechanism for substrate handling, and superior remote control capability.