Used PVA 1266 #293801189 for sale

PVA 1266 is a versatile reactive ion etcher (RIE) or plasma asher equipment designed for semiconductor manufacturing and research applications. This advanced equipment offers precise control over the etching or ashing process, making it ideal for patterning, cleaning, and surface modification of various materials such as silicon, silicon dioxide, metals, and dielectric films. 1266 is equipped with innovative features that ensure high-performance etching/ashing while maintaining a low cost of ownership and user-friendly operation. PVA 1266 etcher/asher operates on the principle of plasma etching, where highly reactive ions and radicals are generated in a low-pressure gas environment to selectively remove material from a substrate. This process is controlled by adjusting parameters such as gas flow rates, RF power, pressure, and temperature to achieve the desired etch rate, selectivity, and profile. The system consists of a vacuum chamber, RF generator, gas delivery unit, and advanced process control software to enable precise process control and monitoring. One of the key features of 1266 machine is its dual-mode operation capability, allowing users to switch between RIE and plasma asher modes easily. In RIE mode, the tool efficiently removes material through physical bombardment of ions, while in asher mode, it effectively removes organic contaminants and residues through chemical reactions with reactive radicals. This flexibility makes PVA 1266 suitable for a wide range of applications, from deep reactive ion etching (DRIE) for MEMS fabrication to photoresist stripping and surface cleaning. 1266 asset offers a range of gas chemistry options to meet specific processing requirements, including fluorine-based gases for silicon etching, oxygen for photoresist stripping, and chlorine-based gases for metal etching. The gas delivery model is equipped with mass flow controllers to precisely control the flow rates of different gases, ensuring uniform and reproducible etching/ashing results. Additionally, the equipment features a built-in gas scrubber to safely remove toxic or corrosive by-products generated during processing. To enhance process reliability and repeatability, PVA 1266 system is equipped with advanced process monitoring and control capabilities. Real-time endpoint detection algorithms allow for accurate process termination based on user-defined criteria such as optical emission spectroscopy signals or pressure changes. The unit also features automated process recipe management, data logging, and remote diagnostics capabilities to streamline operation and troubleshooting. In conclusion, 1266 is a state-of-the-art etcher/asher machine that offers unparalleled performance, versatility, and reliability for demanding semiconductor fabrication and research applications. With its advanced features, dual-mode operation, precise process control, and user-friendly interface, PVA 1266 tool is an essential tool for achieving high-quality etching and ashing results in a cost-effective and efficient manner.