Used PVA 650 #293765024 for sale

PVA 650 is an etcher/ asher used for the removal of film photoresists and other materials in a variety of semiconductor wafer processing applications. It is equipped with a plasma source, a main processing chamber, an exhaust chamber and a wafer handling equipment. The source is gas-fed system which utilizes oxygen, argon, nitrogen, chlorine, and other specialized gases as reactive species. The main chamber is temperature controlled for precise processing and is equipped with a showerhead-type dispenser, which uniformly distributes the etchants onto the wafer surface. The exhaust chamber is designed to operate at low pressure and collect the by-products created during the process. The wafer handling unit consists of a robot arm which transfers wafers throughout the machine and a load lock chamber for transferring wafers into and out of the tool. 650 is dual-chamber asset that combines high-density plasma and chemical etching to achieve maximum etching yields and the shortest processing times. Plasma etching is used to preferentially remove thinner film layers, while the chemical etching is used to achieve the desired etch rate. The wafer surface is treated by ions generated by the plasma source, which imparts directional movement to the etchant molecules, resulting in a high-etch rate and consistent etch profiles. The Etcher/Asher also features a number of process flexibility and control features, such as remote-controlled wafer handling, end-point detection, temperature control, and chlorine and oxygen concentration control. PVA 650 is designed specifically for the semiconductor manufacturing industry, allowing for a complete set of wafer processing operations. It is an effective and versatile etcher/asher, capable of achieving very uniform etch profiles and high throughput. It is designed to provide a clean, safe, and economical wafer processing solution, while meeting the most demanding process requirements and industrial standards.