Used PVA 650 #293804899 for sale

PVA 650 is an advanced etcher and asher designed for use in semiconductor processing. It features a powerful upstream gas delivery equipment and a high-precision, low ablation plasma chamber. The etching chamber can handle a wide variety of temperature, pressure and etching chemistries, making it suitable for a range of semiconductor applications. 650's isolated plasma chamber is designed for long-term stability of gas flow, pressure, and temperature, providing a highly reliable etching process. To ensure precise control of the etching parameters, PVA 650 includes optional real-time pressure and temperature controls. The upstream gas delivery system is able to simultaneously mix up to five process gases, allowing a wide variety of etching chemistries to be employed. Using 650's patented crystalline-etching technology, etch depths of up to 500 nanometers can be achieved. PVA 650's uniformity of etching is its greatest strength, as it minimizes micro-defects and yields consistently high-quality results. The overall unit is easy to use and requires minimal maintenance, making it suitable for high-volume production. Setting process parameters is made easy by two intuitive touch screens. The machine is also compatible with standard vacuum systems, further reducing maintenance costs. When possible, 650 will automatically optimize etch parameters, thereby freeing operators from tedious manual calculations. PVA 650 has superior speed compared to comparable dry etchers, with a high-end etch rate of 70 nanometers per minute and throughput of 35 wafers per hour. This high throughput combined with reliable etching results makes 650 one of the most suitable etcher and asher tools on the market for today's semiconductor applications.