Used PVA TEPLA 400 #9137637 for sale

PVA TEPLA 400 is an etcher/asher developed by the company Plasma-Therm. The equipment is a form of plasma processing field-proven for a wide range of etch and ash applications. It offers a single process chamber to address both etch and ash requirements in a combination etcher/asher design, providing a cost-efficient solution for advanced semiconductor processing. 400 uses dielectric assisted plasma (DAP) technology to create a wide variety of plasma etch and ash processes. It is capable of etching and ashing anything from metals, to ceramics, to polymers and complex materials. The ability to easily switch between etching and ashing enables the system to be used for a variety of processes, including damascene, shallow trench isolation (STI), trench isolation structures (TIS), and via holes. The unit enables high etch rates of up to 15 microns per minute for total feature etching, while maintaining a precision depth and accuracy of 1 to 3 microns. The chamber design offers etch control down to 20 angstroms and etch uniformity of better than 5%. The load port and chamber design integrates a single-wafer recipe process sequence with multi-wafer capability for increased throughput. It also enables chamber stabilization for the highest wafer quality and reproducibility. PVA TEPLA 400 is a highly customizable machine, allowing for efficient integration into existing production lines. The tool is engineered for 200 mm and small-diameter 300 mm wafers, and can be adapted to support a wide range of analytical and diagnostic requirements, including flexible susceptor design, cylindrical inductor design, multiple gas sources, and mapping capability to ensure uniformity. Overall, 400 provides a high-performance, cost-efficient solution to etch and ash challenges in semiconductor device fabrication. The combination etcher/asher design, flexible capability for various process applications, and customizable features make it an ideal solution for various advanced semiconductor devices.