Used PVA TEPLA 600 #68457 for sale

PVA TEPLA 600 is a high-performance etcher/asher used for removing silicon dioxide and silicon nitride layers from many surfaces for memory and logic chip production. The system is a high-temperature, chemically-assisted etching tool that enables users to quickly and effectively clean off silicon dioxide and silicon nitride layers with even etch rates. This single wafer etcher/asher features excellent resolution and high throughput with low chemical consumption, resulting in high yields and extremely accurate patterns on the substrate. 600 is a chemical-assisted etch/asher, meaning surfaces are treated with both plasma and chemistries that react with the surfaces of the substrate. The asher allows for ultra-low residue for improved adhesive and electrical contact performance. Its proprietary, loading-assisted etch process allows for uniform etch rates, resulting in high yields and an excellent resolution. The TEPLA PVA TEPLA 600 offers low chemical consumption capabilities, thanks to its recirculating chemistries and cyclic anticontamination feature. The recirculating chemical feature helps minimize costly chemical waste, optimizing costs for chemical replenishment. This recirculation technique also allows for improved etch rate uniformity. 600 includes an integrated and automated chemical regeneration system, which allows for extended chemical lifetimes. Other features include a programmable high voltage power supply, full lithographic dosage capabilities, and flexible process gas mixing. The automated gas mixing allows for multiple etch recipes, along with a loadlock configuration. Cyclic anticontamination and a timed injection scheme are included for improved reaction control. PVA TEPLA 600 is an ideal tool for removing silicon dioxide and silicon nitride layers from wafers. The system's high-tech features, such as recirculating chemistries and automated gas mixing, combined with its low chemical consumption, enable users to achieve accurate patterns with maximum yields at minimum costs.