Used PVA TEPLA SAM 300 #293640742 for sale

PVA TEPLA SAM 300 is an etcher or asher, specifically designed for plasma etching and ashing processes, that uses a patented rotating chuck functioning as the base-plate. This technology provides a highly reliable, flexible, and accurate approach to etch steps in processes such as chemical mechanical polishing (CMP), etching of through-silicon vias (TSV's), and thinning of wafers. The plate is constructed of stainless steel with an anodized base-plate, which allows for greater chemical stability. The rotating chuck features two chambers of vaporized chemicals and one chamber of neutral gas, with a unique design that delivers a uniform, repeatable plasma process with automated operation. Temperature is controlled to ±2°C in high yield rates and with tight control of plasma parameters. PVA TEPLA SAM300 is capable of processing up to 300mm wafers at a maximum temperature of 450°C. Its advanced software design provides extensive control of etching and cleaning parameters such as substrate temperature, time, pressure, and plasma power, enabling flexibility and accuracy in etching and ashing processes. The chamber-based design also provides protection for the wafers from contamination and chemical damage due to the separation of the etch and ashing chemicals. Its wafer handling capabilities have built-in safeguards that protect the substrates from human error, consistently achieving superior yield rates, regardless of operator level. SAM 300 has been designed and tested for safety compliance to applicable ESD standards, ensuring the safety of operators. SAM300 itself has non-magnetic components, making it suitable for cleanroom or laboratory environments. It features a 7-inch color LCD touch panel, with a graphical user interface that is user-friendly, intuitive, and easy to learn and use. The touch-panel is accessible from any side of the machine, making it easy to view and control the etching and ashing process. Overall, PVA TEPLA SAM 300 is a reliable and efficient solution for plasma etching and ashing processes in the semiconductor industry, perfect for the demanding requirements of laboratories and production floor environments. It offers superior accuracy and repeatability, generating excellent yield rates with tight control of plasma parameters. With its fast and easy operational setup, PVA TEPLA SAM300 is ideal for both tight production schedules and advanced research and development work.