Used PVA TEPLA / TECHNICS PlanarEtch II #9046878 for sale

PVA TEPLA / TECHNICS PlanarEtch II is an etcher/asher designed for high performance wafer etching and ashing, providing a number of significant advantages over traditional etching and ashing processes. It utilizes advanced process control, coupled with a sophisticated chemical delivery equipment for precise control of all process parameters. The system includes a built-in process monitor to allow for precise control and detailing of process results. TECHNICS PlanarEtch II provides chemical delivery of etch and ashing formulations with greater accuracy and control than traditional systems, resulting in better process results and no need for manual intervention. The etching and ashing process can be quickly changed without tooling or expensive modifications. PVA TEPLA PLANAR ETCH II utilizes an advanced chemical delivery unit which is precisely programmed and optimized to deliver precise amounts of etching and ashing components throughout the etching and ashing cycle, resulting in high quality, repeatable results. The etcher/asher is designed with a highly flexible and simple user-interface which allows the user to customize etching and ashing recipes quickly and accurately. The unit incorporates a precision etch head, which is designed to match the substrate etch characteristics in order to maximize process repeatability. The head also provides precise, precise control of time, spatial uniformity and sidewall definition. The etcher/asher also utilizes an advanced dual-side processing technology which allows for simultaneous etching and ashing on both sides of the substrate. The dual-side processing allows for greater process control, improved process uniformity and shorter total processing times. PVA TEPLA / TECHNICS PLANAR ETCH II also features a comprehensive safety machine to ensure operator and device safety at all times. The etcher/asher includes a backside purge tool for both etching and ashing, along with a built-in remote process monitoring asset. The remote monitoring model allows operators to stay up to date and track process details from any device with a web browser. The equipment also includes a variety of carrier types and wafer holders for easy integration into existing production lines. Overall, PLANAR ETCH II provides an efficient and precise etching and ashing process, with various advantages over traditional etching and ashing methods. It's user-friendly interface, safety features and precise process optimization makes it an ideal choice for highly demanding etching and ashing applications.