Used PVA TEPLA / TECHNICS SAM 300 #9039862 for sale
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ID: 9039862
Wafer Size: 6"
Scanning acoustic microscope (SAM), 6"
Up to 8" capable
Scanning range: 250 um X, 250 um Y, 100 mm Z
System RF bandwidth: 500 MHz
(2) 150 MHz Transducers
A-Scan: local time of flight information
B-Scan: analysis mode for virtual cross-sections
C-Scan: imaging of selected gated echos
X-Scan: precision gating of echoes with selectable step sizes for narrow layer by layer sample depth analysis
D-Scan: virtual cross-section scans from sample top to bottom
P-Scan: array of B-scans, free selectable
Auto-Scan: automatically selection to pre-programmed location(s), selects field of view, magnification, auto focus, auto selections of gate parameters and gains for virtually automatic inspection of the samples
Sequence Scan: automated scan of pre-defined areas and gated image positions, including auto focus
Z-Scan: tomography image acquisition with digital reconstruction for virtual volumetric viewing with 3D profiling & non-destructive cross sectioning, acquisition of the entire time of flight information for each x,y pixel
Tray Scan: automated scan of pre-defined areas, including auto focus.
PVA TEPLA / TECHNICS SAM 300 is an etcher/aser, which is designed to be used in industrial and scientific applications that require material processing by way of removal or modification. TECHNICS SAM 300 etcher is equipped with a patented, infinitely variable Speed Control Laser (SCL) technology that provides unparalleled performance accuracy and efficiency. This makes it ideal for precision etching, cutting, and drilling of a variety of materials, including plastics, metals, semiconductor devices, and PCBs. In terms of technology and design, PVA TEPLA SAM 300 features a vacuum chamber that is encased by an epoxy resin, providing a clean operating environment and preventing dust from interfering with the etching process. Its wide temperature range and high power density allow for optimized process performance, which can be further fine-tuned according to the specific requirements of the material to be etched. The etching tool is provided with a four-axis robotic controller, allowing for precise cutting of small and detailed areas. The easily operated programmable inputs further increase the accuracy and swiftness of the etching process. SAM 300 offers advanced laser control options, allowing the user to easily adjust parameters such as laser spot diameter, pulse energy, and etching depth. It also features an automatic depth control system that adjusts the etch depth according to the current process parameters. This is beneficial as it enables very accurate etching processes and also helps to ensure that the etching process is completed correctly. Furthermore, the laser beam can be easily moved in any direction by the machine's four-axis motion control system. In conclusion, PVA TEPLA / TECHNICS SAM 300 is an efficient, user-friendly, and cost-effective etching/aser tool designed to meet the needs of industrial and scientific applications. Its advanced features and customizable options enable users to accurately and quickly etch a variety of materials with ease.
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