Used RAMCO RAM8500-II #293625753 for sale

RAMCO RAM8500-II is an advanced etcher and asher for semiconductor production. It utilizes advanced semiconductor process technologies for fast and reliable etching, ashing, and stripping processes. The machine is designed for maximum flexibility, providing multiple process options to match the needs of your production. RAM8500-II can handle up to 250 wafers per hour for high-volume production lines. It's compatible with a variety of wafer sizes and substrates, including epitaxial silicon, bulk Si, and diamond substrates. The unit is also equipped with a variety of safety features, such as self-monitoring, multiple interlocks, and hazardous gas detection. The machine is designed with a single, self-contained platen assembly containing four loadlock systems. This ensures consistent temperature across the entire platen surface, allowing the machine to process even the most sensitive substrates reliably. The platen assembly also features independent temperature zones and rapid heating and cooling rates. RAMCO RAM8500-II utilizes a variety of advanced etching and ashing techniques, such as ionized gas etching, reactive ion etching, and plasma ashing. This flexibility allows you to fine-tune your processing parameters for optimal substrate selectivity and throughput. Additionally, RAM8500-II is equipped with a built-in leak-forward system, which ensures accurate downward control of the etching and ashing processes. This helps to ensure repeatable and reproducible results over time. RAMCO RAM8500-II provides a range of components for optimizing your processes, such as a programmable timebase for precision time management, a lamination source for high-quality masking and rapid thermal processing, and an isolation module for protecting against short circuits and arcing. Additionally, the machine is compatible with a variety of automated load/unload systems and has an intuitive, user-friendly interface. RAM8500-II is a high-performance etcher and asher designed for fast, reliable, and repeatable production. Its integration of advanced process technologies, self-contained temperature-controlled platen assemblies, and robust safety features make it an ideal choice for semiconductor production environments.