Used SAMCO RIE-152 #293818839 for sale

SAMCO RIE-152 is a plasma etcher/asher equipment designed for high-performance semiconductor device manufacturing and research applications. This equipment utilizes reactive ion etching (RIE) and reactive ion etch (RIE) processes to precisely etch or ash materials with high precision and uniformity. RIE-152 is ideal for a wide range of materials such as silicon, silicon dioxide, silicon nitride, metals, and other dielectric materials commonly used in the microelectronics industry. One of the key features of SAMCO RIE-152 is its advanced plasma generation system. The unit is equipped with a high-power radio frequency (RF) plasma source that efficiently ionizes process gases to produce a highly reactive plasma. This plasma is then used to bombard the surface of the substrate, breaking chemical bonds and removing material through physical or chemical etching mechanisms. The RF plasma source operates at frequencies ranging from 13.56 MHz to 100 MHz, enabling precise control of the plasma density and energy for optimized etching and ashing processes. RIE-152 also features a versatile process chamber with customizable configurations to accommodate various substrate sizes and shapes. The chamber is equipped with temperature control systems to maintain a stable process environment and ensure consistent etching/ashing results. The machine also includes gas flow control modules that allow users to easily adjust process parameters such as gas flow rates, pressure, and composition for different etching/ashing applications. In terms of process capabilities, SAMCO RIE-152 offers a wide range of etching and ashing options to meet different material and device requirements. The tool supports both isotropic and anisotropic etching processes, enabling precise patterning of features with high aspect ratios. Additionally, RIE-152 can perform reactive ion etching of materials with high selectivity and uniformity, making it suitable for advanced device fabrication processes that require tight process control and high reproducibility. SAMCO RIE-152 is also equipped with advanced endpoint detection capabilities to monitor the progress of the etching/ashing processes in real-time. This feature allows users to achieve precise control over process parameters and prevent under- or over-etching of the substrate. The asset offers various endpoint detection techniques such as optical emission spectroscopy (OES), laser interferometry, and ion beam sensors to accurately determine the endpoint of the etching/ashing process. Overall, RIE-152 is a versatile and reliable plasma etcher/asher model that offers high-performance etching and ashing capabilities for semiconductor device manufacturing and research applications. With its advanced plasma generation equipment, customizable process chamber, and versatile process capabilities, SAMCO RIE-152 is an ideal solution for demanding etching and ashing processes in the microelectronics industry.