Used SAMCO RIE-200C #293811813 for sale

SAMCO RIE-200C is a high-performance reactive ion etcher (RIE) and plasma asher designed for precision etching and ashing processes in semiconductor manufacturing and research applications. This advanced tool offers a versatile platform for etching and stripping materials with high accuracy, uniformity, and repeatability. Its sophisticated design and advanced features make it suitable for a wide range of applications, including device fabrication, surface modification, and thin film processing. RIE-200C features a robust vacuum chamber with a high pumping capacity to create and maintain a low-pressure plasma environment for etching and ashing processes. The chamber is equipped with gas inlets for introducing various process gases, such as oxygen, fluorine, and chlorine, to control the plasma chemistry and etching selectivity. The equipment also includes a gas exhaust system to remove by-products and maintain a clean process environment. One of the key features of SAMCO RIE-200C is its advanced RF plasma source, which generates a highly reactive plasma that efficiently interacts with the sample surface to achieve precise etching and stripping results. The unit offers independent control of the RF power, bias power, and gas flow rates, allowing users to tailor the process parameters to achieve specific etching profiles and selectivities. The RF power can be adjusted from a few watts to several hundred watts, providing a wide range of process capabilities for different materials and applications. RIE-200C is equipped with a robust sample stage that can accommodate various wafer sizes, substrates, and sample types. The sample stage features adjustable temperature control and rotation capabilities to ensure uniform etching and ashing across the entire sample surface. The machine includes an advanced endpoint detection tool that monitors the etching process in real-time and automatically stops the process when the desired etch depth or endpoint is reached, ensuring precise control over the etching process. SAMCO RIE-200C offers a user-friendly interface with intuitive software control for easy operation and process monitoring. The asset includes pre-programmed etching recipes for common materials and layers, as well as the flexibility to create custom process recipes based on specific user requirements. The software also provides data logging and analysis tools for process optimization and troubleshooting. In addition to its advanced capabilities for etching and stripping, RIE-200C can also be used for plasma cleaning and surface modification applications. The model's versatility and flexibility make it a valuable tool for researchers and engineers working in semiconductor device development, MEMS fabrication, and microelectronics research. Overall, SAMCO RIE-200C is a reliable and high-performance reactive ion etcher and plasma asher that offers precise control, repeatability, and versatility for a wide range of semiconductor processing applications. Its advanced features, robust design, and user-friendly interface make it an essential tool for achieving high-quality etching and ashing results in research and production environments.