Used SAMCO RIE-200iP #9244966 for sale

SAMCO RIE-200iP is an etcher or asher used to remove material from the surface of a substrate by exposing it to a plasma. The plasma is generated by a Radio Frequency(RF) power source, which is then used to create a reactor chamber where the substrate is held. The substrate is placed on an electrode, and the RF power source is connected to the electrode. The RF power is then used to create an intense electric field which ionizes the gas inside the plasma reactor chamber. This produces a high-energy plasma which is used to etch or asher the surface of the substrate. RIE-200iP is capable of using a variety of gases, including SF6, oxygen, and nitrogen. These gases can be used to etch silicon, quartz, metal, and even organic materials. The etching or ashing process is done at pressures ranging from 0.1 to 150 mbar, and can reach temperatures of up to 800°C. This allows the user to achieve a high degree of precision when performing surface processing operations. The RF generator is capable of producing frequencies ranging from 10 kHz to 40 MHz, and power levels ranging from 0.1 to 300 Watts. This provides the user with complete control over the etching process, enabling them to achieve the best possible surface finish. In addition to etching and ashing, SAMCO RIE-200iP can also be used for deposition, such as PECVD and sputter coating. This is done by introducing a second gas inside the plasma reactor chamber, in addition to the gas used to create the etching or ashing process. This allows the user to coat the surface of the substrate with a thin layer of material, which can be used for a variety of purposes. RIE-200iP is a reliable and durable machine that can be used for a variety of applications. Its user-friendly interface allows for easy setup and operation, making it a great choice for any etching or ashing process. It is also highly accurate and versatile, with the ability to work with a variety of materials and achieve a high degree of precision in the etching or ashing process. This makes it an ideal choice for a wide range of surface processing operations.