Used SAMCO RIE-200iP #9365949 for sale

SAMCO RIE-200iP is an advanced etching/ashing equipment designed for use in semiconductor production. This system provides high-quality, high-precision etching or ashing of wafers and substrates used in a variety of processes. It is equipped with a range of features and controls that allow for precise, repeatable etching or ashing without the risk of contaminants or damage to delicate surfaces. RIE-200iP offers a high-precision pattern etching unit, which utilises advanced hardware and software to provide fast, high-quality etching with minimal thermal damage. Its integrated monitor and control machine allows for accurate monitoring of the process parameters in order to ensure process stability and quality. It also has a self-cleaning process that prevents contamination as well as ensuring optimal operation. The tool is capable of etching various materials, including silicon, gallium arsenide, diamond, copper, polysilicon, and polyimide, with precision that is consistent across all wafers. It utilises a parallel electrode asset to provide high-quality etching, and is equipped with a two-stage electrostatic chuck (ESC) so that both front and rear electrode etching can be performed accurately. SAMCO RIE-200iP also offers improved process control, allowing for fine-tuning of etching parameters such as etching time, temperature, pressure, and doping gas composition without compromising process integrity. It also has an automated gas agitation feature that ensures homogeneous performance throughout the process. In addition, RIE-200iP is equipped with a built-in security model that prevents unauthorized access and ensures the safety of users. Moreover, the equipment is designed for easy integration into existing plant systems, allowing for quick installation and maintenance operations. SAMCO RIE-200iP provides an advanced etching/ashing system that offers superb repeatability and precision. Its integrated hardware and software provide fast, reliable etching and ashing with minimal thermal damage. In addition, its automated features improve process control and enhance security. This unit makes it easy to produce high-quality wafers and substrates with consistent characteristics, making it an ideal tool for semiconductor production.