Used SAMCO RIE-200iP #9395966 for sale

SAMCO RIE-200iP etcher/asher is a computer-controlled, high-precision, inductive-coupled reactive ion etching (RIE) machine that is used for the fabrication of thin-film microelectronic devices, including semiconductors and photonic devices. The machine is designed for high precision etching, ashing, and photoresist stripping with high material accuracy. The machine utilizes the proven, inductively-coupled, plasma-induced RIE technology to produce clean and controllable material etches with little material removal overkill. RIE-200iP is designed to provide maximum material throughput with very low particle generation while maintaining excellent etch uniformity and etch accuracy. The system utilizes both high- and low-pressure RIE processes for precise control of etch rate and material selectivity. The high-pressure operation allows the user to optimize etch rate and selectivity and the low-pressure operation provides high material etch uniformity. The machine has a work chamber measuring 200mm x 200mm (8" x 8"), with adjustable substrate electrodes for fast material processing. A variable RF generator provides substrate bias adjustment with high frequency and high power for fast material processing. SAMCO RIE-200iP has a maximum etch rate of 15 nm/min (~1500A/min) and is capable of a maximum etch depth of 6 µm. The machine is equipped with both a helium mass spectrometer and a Pirani pressure gauge for precise control of the etch process. RIE-200iP can be programmed for single-time or unlimited cycles, allowing for simple customization of the etch process. Additionally, the machine enables the user to run the entire etch process from any remote location. Additionally, the system has been instrumented with a digital interlock system for added safety. SAMCO RIE-200iP is the perfect choice for accurate etching and ashing of thin-film materials and photoresist stripping, especially for light emitting diode (LED), display, and optoelectronic applications. The machine offers maximum precision together with ideal repeatability and uniformity. It is an ideal choice for the fabrication of microelectronic devices, especially for those with extreme precision requirements.