Used SAMCO RIE-200LE #293798663 for sale

SAMCO RIE-200LE is a state-of-the-art plasma etcher/asher designed for semiconductor and MEMS (Microelectromechanical Systems) applications. It is specifically engineered to provide precise and uniform etching of various materials, including silicon, silicon dioxide, silicon nitride, metals, and polymers, making it an essential tool for research and development in the microelectronics and nanotechnology industries. RIE-200LE utilizes reactive ion etching (RIE) technology, a process that involves the use of plasma to selectively remove material from a substrate. This technique offers high etch rates and excellent etch selectivity, making it ideal for creating high aspect ratio features with tight dimensional control. The equipment is equipped with a high-frequency RF power source that generates plasma inside the reaction chamber, where it interacts with the sample surface to perform etching. One of the key features of SAMCO RIE-200LE is its advanced process control capabilities. The system incorporates a precise gas flow control unit that allows users to tailor the etching process parameters, such as gas composition, flow rate, pressure, and temperature, to achieve the desired etch profile and selectivity. Additionally, the machine offers real-time monitoring of process parameters, such as power, pressure, and gas composition, enabling users to fine-tune the etching process for optimal results. RIE-200LE is equipped with a versatile chuck tool that accommodates various sample sizes and shapes, ranging from small semiconductor wafers to larger substrates. The chuck design ensures secure sample mounting and uniform plasma exposure across the entire surface, minimizing non-uniform etching effects and enhancing process repeatability. Moreover, the asset features an active cooling mechanism to maintain sample temperature stability during processing, which is crucial for achieving consistent and reproducible etch results. Another notable feature of SAMCO RIE-200LE is its multi-gas capability, allowing users to perform a wide range of etching processes using different gas chemistries. The model supports commonly used etching gases, such as oxygen, chlorine, fluorine, and sulfur hexafluoride (SF6), as well as specialty gases for specific material etching requirements. This flexibility enables researchers and process engineers to develop custom etching recipes tailored to their unique application needs, whether it involves etching semiconductor devices, MEMS structures, or advanced thin films. In terms of safety and user convenience, RIE-200LE is equipped with comprehensive safety interlocks and monitoring systems to ensure operator protection and equipment integrity during operation. The system features a user-friendly interface that allows for easy setup and operation, with intuitive software controls for configuring process parameters and monitoring unit performance in real time. Additionally, the machine is designed for ease of maintenance, with accessible components and robust construction for long-term reliability. Overall, SAMCO RIE-200LE is a powerful and versatile plasma etcher/asher that offers precise and uniform etching of a wide range of materials for semiconductor and MEMS applications. With its advanced process control capabilities, multi-gas compatibility, and user-friendly design, RIE-200LE is an indispensable tool for research institutions, universities, and semiconductor manufacturing facilities seeking to achieve high-quality etching results with exceptional process control and reliability.