Used SAMCO RIE-212iPC #9036931 for sale
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ID: 9036931
ICP etching system, 8"
System type: cassette-to-cassette production
Active wafer temperature control (Helium backside cooling)
Electrostatic chuck for wafer clamping
Processing of multiple wafers possible using the tray cassette
Fully automatic operation using graphical touch panel screen
Data management and recipe management
Data logging is possible with use of an optional P
Application:
Low-damage etching of GaN, GaAs, InP for production of electronic and light emitting devices
Etching of ferroelectric materials for memory devices
High-speed etching for micromachine production
Currently operational
2009 vintage.
SAMCO RIE-212iPC dry etcher is a high performance tool that facilitates a wide range of etching applications on various materials. Its broad range of features make it a great tool for many uses, including cleaning, creating features, and etching large areas. SAMCO RIE 212 IPC has a chamber size of 6000 cm³ and is capable of reach temperatures of up to 500ºC. It has a high precision heater and an exacting, closed-loop temperature control equipment, allowing the user to precisely control the temperature of the plasma source. RIE-212iPC is equipped with a range of pressure controllers and gas delivery systems. It can be used in a wide range of pressures, allowing you to work with a variety of process gasses. RIE 212 IPC has a high-pressure, high-flow turbomolecular pump that ensures consistent, repeatable, reliable etching and high throughput. SAMCO RIE-212iPC has three dual source plasma source modules, allowing you to select the one that best suits your specific etching application. It has an anti-collision system that prevents damage to the chamber walls, door seals, and chamber components. SAMCO RIE 212 IPC has a range of features designed to make it easy to use, such as an intuitive control interface, automatic plasma recoil, and ample space for sample loading and unloading. It is connected to a sophisticated PC-based control unit, allowing for easy operation and remote access. RIE-212iPC has a high efficiency RF power machine that can deliver up to 200W at 13.56MHz for high quality etch results. It also has an advanced auto-tuning tool, enabling quick setup of the etching process parameters. In summary, RIE 212 IPC dry etcher is an ideal machine for the etching of a wide range of materials. Its high precision, temperature control asset enables precise etching results with minimal gas usage, while its range of pressures, process gasses and source modules provide the flexibility to find the best setup for any application. Its intuitive user interface and high efficiency RF power model make it an excellent choice for etching applications.
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