Used SAMCO RIE-330iPC #9222887 for sale

SAMCO RIE-330iPC is an advanced etcher/asher with superior etching and ashing performance. It is ideal for medical, electronic, and material processing laboratories. This 330W advanced plasma etching and ashing equipment provides high speed and uniform removal of process materials from any substrate type. The system also allows for pre-processing cleaning and residue removal prior to critical chemical processing. This unit is equipped with a precision gas delivery machine, a high-speed motorized stage, and a proprietary RIE process control tool. The precision gas delivery asset provides a gas injection port for precise delivery of gases, as well as a control cable for remote gas flow control. The high-speed motorized stage enables continuous etching and ashing operations with short cycle time and precise control over the process window. The RIE process control model allows for precise process monitoring and control of all etching and ashing operations. RIE-330iPC is also equipped with an automatic wafer transfer equipment that enables the same wafer to be used for multiple etching and ashing operations without manual intervention. The system also features an ion regulation unit to minimize particle migration during processing. This machine is capable of processing wafers with diameters up to 12 inches and is designed to fit in any standard fab environment. SAMCO RIE-330iPC is designed to provide superior etching and ashing rates with minimum contamination. The tool also provides minimal substrate damage and minimal deposition of residue on the substrate. It also allows for quick and easy tool maintenance, with quick and easy tools exchange during processing. Furthermore, this asset offers continuous processing capabilities, with users able to optimize etching processes by adjusting parameters like pressure, temperature, orientation, and etching speed as required. Overall, RIE-330iPC is a highly advanced etching and ashing model with superior performance, available process control, and minimal contamination. It is ideal for medical, electronic, and material processing laboratories, and allows users to quickly and easily etch and ash substrates with minimal substrate damage and residue deposition.