Used SAMCO RIE-330iPC #9412283 for sale

SAMCO RIE-330iPC is one of the industry's most advanced etching/ashing systems, renowned for its high performance and reliability. This etcher/asher can achieve etch rates of up to 2.5µm/min, which is approximately twenty times faster than other etching systems, while maintaining superior etching accuracy of 2.5µm over an area of 100x100mm². RIE-330iPC features a precision 4-axis Cartesian robot arm and a three-stage, intelligent pressure control equipment. It utilizes a cutting edge, deep reactive ion etching (DRIE) process and is highly suitable for cutting and etching organic, ceramic and inorganic materials such as Si, SiO2, CNx, Al and polymers. The system also offers a wide range of optional features such as an advanced auto-focusing, an integrated wafer processing unit, a multi-gas and multi-pressure selection and algorithm, as well as a powerful digital optical microscope for inspecting fine and thin-film patterning. SAMCO RIE-330iPC boasts a cleanroom compatible housing and is available with a wide range of premium vacuum pumps and other components, making it a highly versatile etching machine. In addition, it boasts a real-time process monitoring tool, enabling the user to adjust processes during the etching process to obtain the best results. The asset is also available with a computer controlled software suite, making it easy to setup and manage etching processes. RIE-330iPC is also capable of operating up to 8000 wafers/hour, with a full wafer rotation cycle time of only 4 minutes. This makes it the perfect etching model for high-volume, high-speed production lines. The equipment also has a built-in touch panel user interface and comes with a comprehensive library of (ISO 7952) etching recipes, making it an extremely user-friendly system. In conclusion, SAMCO RIE-330iPC is an ideal etching and ashing solution for a number of industries, offering a powerful and reliable etching unit in a compact, user-friendly package. With its ultrafast etching rates, high accuracy and full wafer rotation, it is perfect for high-volume processing applications.