Used SAMCO RIE-331LC #293766687 for sale

SAMCO RIE-331LC is a versatile reactive ion etcher (RIE) and plasma asher equipment designed for precise and efficient etching and ashing processes in semiconductor and MEMS manufacturing. The system is equipped with advanced features to facilitate a wide range of processes with high accuracy and repeatability. One of the key components of RIE-331LC is its radio frequency (RF) plasma generation unit, which utilizes a high-frequency RF power source to create a plasma of reactive ions that can be directed towards the substrate for etching or asher processes. The RF plasma source allows for precise control of the ion energy and density, enabling the machine to achieve high etch rates while maintaining excellent process uniformity across the substrate surface. SAMCO RIE-331LC features a robust vacuum chamber with multiple gas inlets for introducing a variety of process gases, including etchants and reactants, to tailor the etching or asher process according to the specific requirements of the application. The tool also includes a turbo molecular pump and a dry pump for efficient gas evacuation and chamber cleaning, ensuring a clean and stable process environment for optimal etching and asher performance. To enhance process control and optimization, RIE-331LC is equipped with a sophisticated gas flow control asset that allows for precise regulation of gas flow rates and mixtures during the etching or asher process. This ensures consistent process conditions and enables the model to achieve high process repeatability and uniformity, critical for achieving tight process tolerances in semiconductor device fabrication. SAMCO RIE-331LC also features a versatile substrate handling equipment that can accommodate various substrate sizes and types, including silicon wafers, glass substrates, and flexible substrates, allowing for flexibility in processing a wide range of materials in different form factors. The system includes a motorized substrate stage with precise positioning capabilities to ensure accurate alignment and uniform processing of the substrate during etching or asher processes. For process monitoring and control, RIE-331LC is equipped with a range of advanced diagnostics and control systems, including real-time plasma emission spectroscopy, endpoint detection, and process recipe management software. These features enable operators to monitor process parameters, detect process endpoint, and optimize process recipes for improved process control and productivity. In summary, SAMCO RIE-331LC is a high-performance reactive ion etcher and plasma asher unit designed for demanding semiconductor and MEMS manufacturing processes. With its advanced plasma generation machine, gas flow control capabilities, versatile substrate handling tool, and comprehensive process monitoring and control features, the asset offers a reliable and efficient solution for achieving precise and repeatable etching and asher processes in a variety of applications.