Used SAMCO RIE-400iPB #293682703 for sale

SAMCO RIE-400iPB is a versatile and high-performance reactive ion etcher (RIE) / plasma asher equipment designed for advanced etching and cleaning processes in semiconductor device fabrication, MEMS (micro-electromechanical systems) manufacturing, and research applications. This cutting-edge tool provides a range of capabilities for precise etching and plasma cleaning of various materials with high uniformity and repeatability. One of the key features of RIE-400iPB is its advanced plasma processing technology, which enables highly controlled etching and ashing of a wide range of materials including silicon, silicon dioxide, silicon nitride, metals, and dielectrics. The system is equipped with a high-density plasma source that generates reactive ions and radicals to remove material from the substrate surface with high selectivity and etch rates. SAMCO RIE-400iPB features a versatile process chamber with a large substrate platen that can accommodate substrates up to 200mm in diameter. This allows for batch processing of multiple samples or large-area substrates, increasing productivity and throughput. The unit also includes advanced temperature control and gas flow management systems to optimize process conditions and ensure uniformity across the entire substrate surface. The machine is equipped with a state-of-the-art RF power supply that enables precise and stable control of plasma density and energy during the etching process. This allows for fine-tuning of process parameters to achieve the desired etch profile, selectivity, and sidewall passivation. The tool also features a reactive gas delivery asset with multiple gas inlets for customizing the process chemistry and achieving specific etching chemistries. In addition to its etching capabilities, RIE-400iPB can also function as a plasma asher for removing photoresist, polymer residues, and contaminants from the substrate surface. The model is equipped with a dedicated ashing mode that allows for gentle and efficient removal of organic films without damaging the underlying materials. This feature makes SAMCO RIE-400iPB a versatile tool for post-etch cleaning and preparation of substrates for subsequent processing steps. The equipment is controlled by an intuitive software interface that allows users to easily program and monitor the etching and ashing processes in real-time. The software offers a wide range of process recipes and parameter settings to accommodate different material types and process requirements. Additionally, the system is equipped with advanced safety features such as emergency shutdown protocols and gas leak detection systems to ensure operator and equipment safety during operation. Overall, RIE-400iPB is a highly advanced and reliable tool for precise etching and plasma cleaning applications in semiconductor and MEMS manufacturing. With its high-performance capabilities, flexible process control, and user-friendly interface, SAMCO RIE-400iPB is an ideal solution for research and production environments requiring high-quality and repeatable plasma processing results.