Used SAMCO UV-300H #18311 for sale
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ID: 18311
UV Ozone stripper
Operating pressure: Atmospheric
Venting:
Teflon
Stainless steel / Aluminum construction
Compressed air:
Dry air
85-PSIG
Process gasses:
Oxygen (O2) - 14.2 PSIG
20 SLM Flow (Maximum)
Purge:
Nitrogen (N2) - 25 PSIG
37-50 SLM Flow
Cooling water:
50 - 75° F
48 - 42 PSIG
Substrate loading:
Easy
Drawer type: Slide to load substrates
Power: 115 VAC, 40 A, Single phase.
SAMCO UV-300H is an etcher/asher with a four-stage process used for the micromachining and thin-film removal of multiple materials in a single equipment. It has a large processing area (height of 300 mm, width of 450 mm) and can process boards up to 6 mm in thickness. The system has a high precision automatically controlled wafer stage, allowing multiple wafers or substrates to be aligned for uniform processing. An optional stage waist heater helps to maintain the substrate temperature for challenging applications. UV-300H features a two-stage gas delivery unit, allowing for the use of corrosive and non-corrosive gases, and a two-stage process cycle. The first stage places the target wafer or substrate onto the wafer stage while the second stage is used to set the process parameters and initialize the process. During the process, the wafer is exposed to a light-emitting chemical (LEC), which is absorbed by the exposed material and converted into a gas that is then ablated by a plasma. SAMCO UV-300H is capable of a wide range of material removal processes. It can be used for multi-material thin-film deposition, removal and surface treatment. It can also be used to create device structures and patterns for thin-film resistors, transistors and other microelectronic components. The machine is equipped with a vacuum suction tool, allowing for the removal of debris generated during the processing. The etch-safe operating environment of UV-300H promotes a safe etching process. It has an integrated safety function and sensitive anti-overheat detection, which halts the process if the temperature exceeds a pre-set level or limit. It also includes a dust-proof wafer tray, preventing dust particles from entering the asset. SAMCO UV-300H is capable of both precision micromachining as well as low-temperature ashing. This is an important advantage as multiple etching processes can be carried out without having to change the model configuration. It is a cost-effective, reliable and high-performance equipment designed to meet the demands of modern microelectronics processing.
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