Used SEZ / LAM RESEARCH 223 #293748588 for sale

SEZ / LAM RESEARCH 223 is a high-end dry etch equipment. It is a production-grade system designed for the etching of wafers up to 8" (200mm) in diameter. The unit is designed to achieve superior etching performance and production throughput in process materials that include Silicon, Silicon Nitride, Silicon Dioxide, Silicon Carbide, Indium Tin Oxide and other engineering materials. The machine's uniformity of etch is among the highest achieved in the etching process. The tool consists of a main chamber and a transfer chamber connected by two load locks. The main chamber is equipped with two independent targets which are used for both dry etching and ashing applications. The transfer chamber is equipped with two load locks, two robot arms and a sub-chamber for in-situ main chamber cleaning. SEZ 223 features a powerful multi-source, multi-frequency, RF generator offering co-sputtering and duoprocess capabilities. These features allow users to optimize etch profiles for the highest degree of precision in etch shape and control. The multi-frequency generator also enables adjustable process control allowing the user to dial in etch rates and profiles in a variety of materials and etch applications. Additionally, the asset is designed to operate at very low pressures. In addition to the etch capability, LAM RESEARCH 223 features advanced ashing capabilities with options for both selective dry ashing and uniform dry ashing. The selective dry ashing enables the etch model to remove localized regions of films and deposits from wafer surfaces maximizing process uniformity metal-free regions. The uniform dry ashing uses a uniform process, creating a uniform layer of deposited material across the wafer surface. 223 also features a load lock decompression equipment which improves the system safety and process stability by eliminating contamination. The RTP control software offers advanced process control by forcing low pressure operation, high uniformity and higher plasma density, even at low accelerated energies. The unit offers excellent repeatability and maximum substrate uniformity. Overall, SEZ / LAM RESEARCH 223 is an advanced etching and ashing machine suitable for a variety of materials and process applications. The tool offers excellent etch uniformity and advanced process control. The asset is optimized for use with variety of process wafers up to 8" (200mm) in diameter and for very low pressures. The model offers excellent repeatability and maximum substrate uniformity, providing users with superior etching performance and production throughput.