Used SEZ / LAM RESEARCH 304 #9224044 for sale

SEZ / LAM RESEARCH 304 is an etcher/asher used in semiconductor processing. It is an accelerated physical etching process which uses a copper/beryllium/oxygen (CuBeO) source to acquire a high-rate, precise, and uniform film etching over a wide range of materials. The etcher/asher offers versatile process capability for accommodating different etching requirements including wet etching, dry etching, and wet-dry etching. The primary operation of SEZ 304 is to provide a high rate etching process for semiconductor wafers. The device features two independent chambers for simultaneous etching of up to two workpieces. It is designed with dual varying frequency RF generators that enable it to generate multiple frequencies, as low as 100kHz and as high as 10MHz. The frequency adjustments allow for precise etch control and uniform film etching. The process is initiated through a computerized control system that provides a comprehensive set of programmable parameters for controlling the etch pattern, etch rate, and etch depth. The parameters are easily adjustable, allowing for efficient etching. The etcher/asher also features a safety interlock that prevents unauthorized personnel from entering the workplate area. This additional safety measure helps to prevent mishaps and ensure safe handling of semiconductor wafers. LAM RESEARCH 304 is cost-effective and provides uniform etching capabilities for a wide variety of materials. The etcher/asher provides flexibility and scalability, making it ideal for a wide range of applications. It also features an etching chamber that can be quickly cooled down using a water-cooled system. This enhances process stability and helps to achieve consistent etch results. Overall, 304 is an etcher/asher specifically designed for semiconductor processing. It features adjustable parameters for precise etching, a safety interlock, dual frequency RF generators, a quick cool down mechanism, and scalability for applications. With its cost-effective design and uniform etching capability, it is ideal for providing a reliable, cost-effective etching process for semiconductor wafers.